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參數(shù)資料
| 型號： | HS-6664RH |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened 8K x 8 CMOS PROM |
| 中文描述： | 輻射加固8K的× 8的CMOS胎膜早破 |
| 文件頁數(shù)： | 10/14頁 |
| 文件大小： | 222K |
| 代理商： | HS-6664RH |
849
HS-6664RH
Spec Number
518741
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the lim-
its of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum lim-
its of lead dimensions b and c or M shall be measured at the cen-
troid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-brazed lead packages, no organic or polymeric mate-
rials shall be molded to the bottom of the package to cover the
leads.
8. Dimension Q shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension Q minimum
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-
der dip lead finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
-D-
-C-
0.004
H A - B
M
D
S
S
-A-
-B-
0.036
H A - B
M
D
S
S
e
E
A
Q
L
D
A
A
E1
SEATING AND
BASE PLANE
L
E2
E3
E3
-H-
b
C
S1
M
c1
b1
(c)
(b)
SECTION A-A
BASE
METAL
LEAD FINISH
PIN NO. 1
ID AREA
M
K28.A
MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B)
28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.045
0.115
1.14
2.92
-
b
0.015
0.022
0.38
0.56
-
b1
0.015
0.019
0.38
0.48
-
c
0.004
0.009
0.10
0.23
-
c1
0.004
0.006
0.10
0.15
-
D
-
0.740
-
18.80
3
E
0.460
0.520
11.68
13.21
-
E1
-
0.550
-
13.97
3
E2
0.180
-
4.57
-
-
E3
0.030
-
0.76
-
7
e
0.050 BSC
1.27 BSC
-
k
0.008
0.015
0.20
0.38
2
L
0.250
0.370
6.35
9.40
-
Q
0.026
0.045
0.66
1.14
8
S1
0.00
-
0.00
-
6
M
-
0.0015
-
0.04
-
N
28
28
-
Rev. 0 5/18/94
Packaging
(Continued)
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| HS-6664RH_00 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8K x 8 CMOS PROM |
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