
DSD1702
SLES005A
–
JUNE 2001
–
REVISED FEBRUARY 2002
3
www.ti.com
Terminal Functions
TERMINAL
I/O
DESCRIPTIONS
NAME
DSDL
PIN
1
I
Audio data digital input (DSD L
–
channel) (see Note 1)
DSDR
2
I
Audio data digital input (DSD R
–
channel) (see Note 1)
PBCK
3
I
Audio data bit clock input. (PCM) (see Note 1)
PDATA
4
I
Audio data digital input. (PCM) (see Note 1)
PLRCK
5
I
Audio data latch enable input. (PCM) (see Note 1)
DGND
6
–
Digital ground
VDD
VCC
VOUTL
VOUTR
AGND
7
–
Digital power supply, 3.3 V
8
–
Analog power supply, 5 V
9
O
Analog output for L
–
channel
10
O
Analog output for R
–
channel
11
–
Analog ground
VCOM
ZEROR/ZEROA
12
–
Common voltage decoupling
13
O
Zero flag output for R
–
channel/zero flag output for L/R
–
channel. (see Note 3)
ZEROL/NA
14
O
Zero flag output for L
–
channel/no assignment (see Note 3)
MD
15
I
Mode control data Input. (see Note 2)
MC
16
I
Mode control clock input. (see Note 2)
MS
17
I
Chip Select for Mode control. (see Note 2)
PSCK
18
I
System clock input. (PCM) (see Note 1)
DSCK
19
I
System clock input. (DSD) (see Note 1)
DBCK
20
I
Audio data bit clock input. (DSD) (see Note 1)
NOTES:
1. Schmitt trigger input, 5-V tolerant.
2. Schmitt trigger input with internal pulldown, 5-V tolerant.
3. Usage depending on AZRO register setting.
absolute maximum ratings
Supply voltage, V
DD
Supply voltage, V
CC
Ground voltage differences, AGND, DGND
Digital input voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current (Any pins except supplies)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ambient temperature under bias
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package temperature (IR reflow, peak)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.5 V
4 V
±
0.1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to (6.5 V + 0.3 V)
±
10 mA
–
40
°
C to 125
°
C
–
55
°
C to 125
°
C
150
°
C
260
°
C, 5 sec
235
°
C, 10 sec
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.