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參數(shù)資料
| 型號(hào)： | CS43L22-CNZR |
| 廠商： | Cirrus Logic Inc |
| 文件頁(yè)數(shù)： | 59/66頁(yè) |
| 文件大小： | 0K |
| 描述： | IC DAC W/HDPN & SPKR AMPS 40-QFN |
| 標(biāo)準(zhǔn)包裝： | 4,000 |
| 位數(shù)： | 24 |
| 數(shù)據(jù)接口： | 串行 |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 40-VFQFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 40-QFN（6x6） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 2 電壓，單極 |
| 采樣率（每秒）： | 96k |
| 配用： | 598-1529-ND - BOARD EVAL FOR CS43L22 |
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62
DS792F2
CS43L22
Confidential Draft
3/4/10
10.PCB LAYOUT CONSIDERATIONS
10.1
Power Supply, Grounding
As with any high-resolution converter, the CS43L22 requires careful attention to power supply and ground-
ing arrangements if its potential performance is to be realized. Figure 1 on page 9 shows the recommended
power arrangements, with VA and VHP connected to clean supplies VD, which powers the digital circuitry,
may be run from the system logic supply. Alternatively, VD may be powered from the analog supply via a
ferrite bead. In this case, no additional devices should be powered from VD.
Extensive use of power and ground planes, ground plane fill in unused areas and surface mount decoupling
capacitors are recommended. Decoupling capacitors should be as close to the pins of the CS43L22 as pos-
sible. The low value ceramic capacitor should be closest to the pin and should be mounted on the same
side of the board as the CS43L22 to minimize inductance effects.
All signals, especially clocks, should be kept away from the FILT+ and VQ pins in order to avoid unwanted
coupling into the modulators. The VQ decoupling capacitors, particularly the 0.1 F, must be positioned to
minimize the electrical path from AGND. The CDB43L22 evaluation board demonstrates the optimum layout
and power supply arrangements.
10.2
QFN Thermal Pad
The CS43L22 is available in a compact QFN package. The underside of the QFN package reveals a large
metal pad that serves as a thermal relief to provide for maximum heat dissipation. This pad must mate with
an equally dimensioned copper pad on the PCB and must be electrically connected to ground. A series of
vias should be used to connect this copper pad to one or more larger ground planes on other PCB layers.
In split ground systems, it is recommended that this thermal pad be connected to AGND for best perfor-
mance. The CS43L22 evaluation board demonstrates the optimum thermal pad and via configuration.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CS43L23-CWZR | 功能描述:IC DAC W/HDPN & SPKR AMPS 40-QFN 制造商:cirrus logic inc. 系列:* 零件狀態(tài):Not For New Designs 標(biāo)準(zhǔn)包裝:6,000 |
| CS43L36-CNZ | 功能描述:IC-LOWPOWERHIGHPERFORMANCE HEADP 制造商:cirrus logic inc. 系列:* 零件狀態(tài):在售 標(biāo)準(zhǔn)包裝:490 |
| CS43L41 | 制造商:CIRRUS 制造商全稱:Cirrus Logic 功能描述:Low Power 24-Bit, 96 kHz DAC with Volume Control |
| CS43L41-KZ | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| CS43L42 | 制造商:CIRRUS 制造商全稱:Cirrus Logic 功能描述:Low Voltage,Stereo DAC With Headphone Amp |
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