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CB65000 Series
March 2002 
FEATURE
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 0.18micron drawn, six layers of metal connected 
by fully stackable vias and contacts, Shallow 
Trench Isolation, low resistance, salicided 
active areas and gates. Deep UV lithography.
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 1.8 V optimized High Performance and Low 
Leakage transistors with 3.3 V  I/O and supply 
interface capability.
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 Average gate density: 85K/mm
2
, plus low power 
consumption of 30nanoWatt/Gate/MHz/
Stdload.
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 Two input NAND delay of 35ps with High 
Performane transistor and 60ps with Low 
Leakage transistor.
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 Library available in commercial, industrial and 
military temperature range. Power supply 
ranging from 1.2V and 1.95V for Core 
(according to JESD 8-7 specification) and 
between 3.0V and 3.6V for I/Os (alligned with 
JESD 8-A specification).
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 Broad I/O functionality including:
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 Low Voltage CMOS. 
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 Low Voltage TTL,HSTL, SSTL.
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 AGP 2X and 4X, USB, PCI, LVDS I/O interfaces 
are also available.
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 Drive capability up to 8 mA per buffer with slew 
rate control, current spike suppression 
impedance matching, and process 
compensation capability to reduce delay 
variation.
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 Designs easily portable from previous 
generations of CB55000 with an average factor 
2 density increase, 30% speed improvement
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 and 2.5 power reduction at respective nominal 
voltages.
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 Generators to support Single Port, Dual port 
and multiple Port RAM, and ROMs with BIST 
options.
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 Extensive embedded function library including 
ST DSP and micro-cores, third-party IPs, 
Synopsys and Mentor Inventra synthetic 
libraries ideally suited for complete System On 
Chip fast integration .
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 Embedded DRAM Capability
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 80
 μ
m pitch linear and 50
 μ
m staggered pad 
libraries.
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 Fully independent power and ground 
configuration for core and I/Os supported.
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 I/O ring capability up to 1500 pads.
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 Latch-up trigger current > ± 500 mA. ESD 
protection above 4 kV in H.B.M.
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 Oscillators and PLLs for wide frequency 
spectrum.
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 Broad range of more than 600 SSI cells.
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 Design for test features including IEEE 1149.1 
JTAG Boundary Scan architecture.
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 Synopsys, Cadence and Mentor based design 
systems with interface from multiple 
workstations.
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 Broad range of packaging solutions, including 
PBGA, LBGA, SBGA, HPBGA, TQFP, PQFP, 
PLCC up to 1000 pins with enhanced power 
dissipation options.
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 1.25 GigaHertzGigabit DLL technique.
CB65000 Super Integration
Cost Effective Product
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 Architecture partitioning
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 Trouble-free integration
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 Application-specific
Your Product is Unique
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 User specified cell integration
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 Design confidentiality
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 IP fully re-usable
HCMOS8D 0.18
μ
m Standard Cells Family