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參數(shù)資料
| 型號： | AM486DX4 |
| 廠商： | Advanced Micro Devices, Inc. |
| 英文描述： | High-Performance, Clock-Selectable, 3.3 V, 32-Bit Microprocessor(3.3V高性能時鐘可選32位微處理器) |
| 中文描述： | 高性能，時鐘可選，3.3伏，32位微處理器（3.3高性能時鐘可選32位微處理器） |
| 文件頁數(shù)： | 24/26頁 |
| 文件大?。?/td> | 335K |
| 代理商： | AM486DX4 |
AMD
24
Am486DX4 Microprocessor
P R E L I M I N A R Y
Package Thermal Specifications
The Am486DX4 microprocessor is specified for opera-
tion when T
CASE
(the case temperature) is within the
range of 0
°
C to +85
°
C. T
CASE
can be measured in any
environment to determine whether the Am486DX4 mi-
croprocessor is within specified operating range. The
case temperature should be measured at the center of
the top surface opposite the pins.
The ambient temperature (T
A
) is guaranteed as long as
T
CASE
is not violated. The ambient temperature can be
calculated from
θ
JC
and
θ
JA
and from the following
equations:
T
J
= T
CASE
+ P
θ
JC
T
A
= T
J
– P
θ
JA
T
CASE
= T
A
+ P [
θ
JA
–
θ
JC
]
——————————————————————————————————————————————————————————————
Table 9. Thermal Resistance (°C/W)
θ
JC
and
θ
JA
for the 168-Pin, Ceramic PGA Package
where:
T
J
, T
A
, T
CASE
= Junction, Ambient, and Case Tempera-
ture.
θ
JC
,
θ
JA
= Junction-to-Case and Junction-to-Ambient
Thermal Resistance, respectively.
P = Maximum Power Consumption
The values for
θ
JA
and
θ
JC
are given in Table 9 for the
1.75 sq. in., 168-pin, ceramic PGA.
Table 10 shows the T
A
allowable (without exceeding
T
CASE
) at various airflows and operating frequencies
(Clock). Note that T
A
is greatly improved by attaching
fins or a heat sink to the package. Heat sink dimen-
sions are shown in Figure 10. P (the maximum power
consumption) is calculated by using the maximum I
CC
at 3.3 V as tabulated in the
DC Characteristics
.
*0.350
″
high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing).
θ
JC
θ
JA
vs. Airflow-ft/min. (m/sec)
400 (2.03)
12.0
0 (0)
16.5
200 (1.01)
14.0
600 (3.04)
10.5
800 (4.06)
9.5
1000 (5.07)
9.0
No Heat Sink
1.5
Heat Sink*
2.0
12.0
7.0
5.0
4.0
3.5
3.25
Heat Sink* and fan
2.0
5.0
4.6
4.2
3.8
3.5
3.25
Table 10. Maximum T
A
at Various Airflows in
°
C
Clock
Airflow-ft/min. (m/sec)
0 (0)
200 (1.01)
400 (2.03)
600 (3.04)
800 (4.06)
1000 (5.07)
T
A
—No Heat Sink
100 MHz
31.0
41.8
49.0
54.4
58.0
59.8
T
A
—Heat Sink
100 MHz
49.0
67.0
74.2
77.8
79.6
80.5
120 MHz
41.8
63.4
72.0
76.4
78.5
79.6
T
A
—Heat Sink and fan
100 MHz
74.2
75.6
77.1
78.5
79.6
80.5
120 MHz
72.0
73.8
75.5
77.2
78.5
79.6
Figure 10. Heat Sink Dimensions
0.290
″
0.100
″
0.040
″
1.53
″
0.350
″
0.060
″
0.115
″
17852B-113
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