參數(shù)資料
型號: ADSP-21479KSWZ-2A
廠商: Analog Devices Inc
文件頁數(shù): 59/72頁
文件大?。?/td> 0K
描述: IC DSP SHARC 266MHZ LP 100LQFP
標準包裝: 1
系列: SHARC®
類型: 浮點
接口: DAI,DPI,EBI/EMI,I²C,SPI,SPORT,UART/USART
時鐘速率: 266MHz
非易失內(nèi)存: ROM(4Mb)
芯片上RAM: 5Mb
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.20V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-LQFP 裸露焊盤
供應商設備封裝: 100-LQFP-EP(14x14)
包裝: 托盤
其它名稱: Q6418433
Rev. A
|
Page 62 of 72
|
September 2011
THERMAL CHARACTERISTICS
The processor is rated for performance over the temperature
Table 56 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (PBGA). The junction-to-case mea-
surement complies with MIL- STD-883. All measurements use a
2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
where:
TJ = junction temperature °C
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter is
the Typical value from Table 56.
PD = power dissipation
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approxi-
mation of TJ by the equation:
where:
TA = ambient temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val-
ues provided in Table 56 are modeled values.
Figure 51. Typical Output Rise/Fall Time (20% to 80%,
VDD_EXT = Min)
Figure 52. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
LOAD CAPACITANCE (pF)
6
0
10
4
2
RISE
AND
FALL
TIMES
(ns)
25
200
150
50
75
100
125
175
y = 0.0567x + 0.482
y = 0.0367x + 0.4502
y = 0.0314x + 0.5729
TYPE A DRIVE FALL
TYPE A DRIVE RISE
TYPE B DRIVE RISE
TYPE B DRIVE FALL
8
12
14
y = 0.0748x + 0.4601
LOAD CAPACITANCE (pF)
3
0
3.5
2
1
0.5
1.5
RISE
AND
FALL
DELAY
(ns)
2.5
y = 0.015x + 1.4889
y = 0.0088x + 1.6008
y = 0.0199x + 1.1083
y = 0.0102x + 1.2726
0
25
200
150
50
75
100
125
175
TYPE A DRIVE FALL
TYPE A DRIVE RISE
TYPE B DRIVE RISE
TYPE B DRIVE FALL
4
4.5
T
J
T
CASE
Ψ
JT
P
D
×
()
+
=
Table 56. Thermal Characteristics for 100-Lead LQFP_EP
Parameter
Condition
Typical
Unit
θJA
Airflow = 0 m/s
18.1
°C/W
θJMA
Airflow = 1 m/s
15.5
°C/W
θJMA
Airflow = 2 m/s
14.6
°C/W
θJC
2.4
°C/W
ΨJT
Airflow = 0 m/s
0.22
°C/W
ΨJMT
Airflow = 1 m/s
0.36
°C/W
ΨJMT
Airflow = 2 m/s
0.50
°C/W
Table 57. Thermal Characteristics for 196-Ball CSP_BGA
Parameter
Condition
Typical
Unit
θJA
Airflow = 0 m/s
29.0
°C/W
θJMA
Airflow = 1 m/s
26.1
°C/W
θJMA
Airflow = 2 m/s
25.1
°C/W
θJC
8.8
°C/W
ΨJT
Airflow = 0 m/s
0.23
°C/W
ΨJMT
Airflow = 1 m/s
0.42
°C/W
ΨJMT
Airflow = 2 m/s
0.52
°C/W
T
J
T
A
θ
JA
P
D
×
()
+
=
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