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參數(shù)資料
| 型號： | ADN8102ACPZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 24/36頁 |
| 文件大小： | 0K |
| 描述： | IC EQUALIZER 4CH XSTREAM 64LFCSP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | XStream™ |
| 應(yīng)用： | 以太網(wǎng)控制器 |
| 接口： | I²C |
| 電源電壓： | 1.8 V ~ 3.3 V |
| 封裝/外殼： | 64-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 64-LFCSP-VQ（9x9） |
| 包裝： | 托盤 |
| 安裝類型： | 表面貼裝 |
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ADN8102
Rev. B | Page 30 of 36
Stencil Design for the Thermal Paddle
Large voids in the thermal paddle area should be avoided. To
control voids in the thermal paddle area, solder masking may be
required for thermal vias to prevent solder wicking inside the
via during reflow, thus displacing the solder away from the
interface between the package thermal paddle and thermal
paddle land on the PCB. There are several methods employed
for this purpose, such as via tenting (top or bottom side), using
dry film solder mask; via plugging with liquid photo-imagible
(LPI) solder mask from the bottom side; or via encroaching.
These options are depicted in Figure 48. In case of via tenting,
the solder mask diameter should be 100 microns larger than the
via diameter.
To effectively remove heat from the package and to enhance
electrical performance, the thermal paddle must be soldered
(bonded) to the PCB thermal paddle, preferably with minimum
voids. However, eliminating voids may not be possible because
of the presence of thermal vias and the large size of the thermal
paddle for larger size packages. Also, outgassing during the
reflow process may cause defects (splatter, solder balling) if the
solder paste coverage is too big. It is recommended that smaller
multiple openings in the stencil be used instead of one big
opening for printing solder paste on the thermal paddle region.
This typically results in 50% to 80% solder paste coverage.
Figure 47 shows how to achieve these levels of coverage.
(A)
(B)
(D)
(C)
VIA
SOLDER
MASK
COPPER
PLATING
07
06
0-
1
52
Voids within solder joints under the exposed paddle can have
an adverse affect on high speed and RF applications, as well as
on thermal performance. Because the LFCSP package incor-
porates a large center paddle, controlling solder voiding within
this region can be difficult. Voids within this ground plane can
increase the current path of the circuit. The maximum size for a
void should be less than via pitch within the plane. This assures
that any one via is not rendered ineffectual when any void
increases the current path beyond the distance to the next
available via.
Figure 48. Solder Mask Options for Thermal Vias: (a) Via Tenting from the
Top; (b) Via Tenting from the Bottom; (c) Via Plugging, Bottom; and (d) Via
Encroaching, Bottom
1.35mm × 1.35mm SQUARES
AT 1.65mm PITCH
COVERAGE: 68%
07
06
0-
1
51
A stencil thickness of 0.125 mm is recommended for 0.4 mm and
0.5 mm pitch parts. The stencil thickness can be increased to
0.15 mm to 0.2 mm for coarser pitch parts. A laser-cut, stainless
steel stencil is recommended with electropolished trapezoidal
walls to improve the paste release. Because not enough space is
available underneath the part after reflow, it is recommended
that no clean Type 3 paste be used for mounting the LFCSP.
Inert atmosphere is also recommended during reflow.
Figure 47. Typical Thermal Paddle Stencil Design
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADN8102ACPZ-R7 | 功能描述:IC EQUALIZER 4CH XSTREAM 64LFCSP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:XStream™ 特色產(chǎn)品:NXP - I2C Interface 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:2 通道 I²C 多路復(fù)用器 接口:I²C，SM 總線 電源電壓:2.3 V ~ 5.5 V 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:剪切帶 (CT) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:825 (CN2011-ZH PDF) 其它名稱:568-1854-1 |
| ADN8102-EVALZ | 制造商:AD 制造商全稱:Analog Devices 功能描述:3.75 Gbps Quad Bidirectional CX4 Equalizer |
| ADN8102XCPZ | 功能描述:Ethernet Controller Interface 制造商:analog devices inc. 系列:XStream?? 包裝:- 零件狀態(tài):上次購買時間 應(yīng)用:以太網(wǎng)控制器 接口:I2C 電壓 - 電源:1.8 ~ 3.3V 封裝/外殼:- 供應(yīng)商器件封裝:- 安裝類型:- 標(biāo)準(zhǔn)包裝:1 |
| ADN8810 | 制造商:Analog Devices 功能描述:- Bulk |
| ADN8810ACP | 制造商:Analog Devices 功能描述:Current Source 24-Pin LFCSP EP |
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