參數(shù)資料
型號： 03H4969
元件分類： 通信及網(wǎng)絡(luò)
英文描述： SPECIALTY TELECOM CIRCUIT, PQFP100
封裝： 14 X 20 MM, 2.70 MM HEIGHT, 0.65 MM PITCH, PLASTIC, FP-100
文件頁數(shù)： 40/48頁
文件大?。?/td> 464K
代理商： 03H4969
Product Part Number: IBM22-ALDC1005S
ALDC1-5S
I B M Microelectronics
Document Number: DCALD5DSU-04
Data Compression
Appendix B. IBM ALDC Compression Products
Figure
B-1. IBM ALDC Compression Products
PRODUCT NAME (OEM
CATALOG NUMBER)
PACKAGE
DESCRIPTION
AVAIL-
ABILITY
ALDC1-5S-L
(IBM22-ALDC1005S-00)
100 lead low quad
flat package. 14
mm x 14 mm x 1.4
mm body size with
0.5 mm lead
spacing.
Maximum 5 MB/s data rate for
compression and decom-
pression. The microprocessor
interface, original data inter-
face, and compressed data
interface all use one-byte wide
data buses.
Now
ALDC1-5S-P
(IBM22-ALDC1005S-01)
100 lead plastic flat
package. 14 mm x
20 mm x 2.7 mm
body size with 0.65
mm lead spacing.
Maximum 5 MB/s data rate for
compression and decom-
pression. The microprocessor
interface, original data inter-
face, and compressed data
interface all use one-byte wide
data buses.
Now
ALDC1-20S-H
(IBM22-ALDC1020S-00)
144 lead plastic flat
package with heat
spreader. 28 mm x
28 mm x 3.8 mm
body size with 0.65
mm lead spacing.
Maximum 20 MB/s data rate for
compression and decom-
pression. The microprocessor
interface uses a one- or two-
byte wide data bus which oper-
ates in two handshaking
modes. The original data inter-
face and compressed data
interface use one- or two-byte
wide data buses which operate
in four handshaking modes.
Samples
now
ALDC1-40S-M
(IBM22-ALDC1040S-00)
144 lead plastic flat
package with
molded heat sink.
28 mm x 28 mm x
3.8 mm body size
with 0.65 mm lead
spacing.
Maximum 40 MB/s data rate for
compression and decom-
pression. The microprocessor
interface uses a one- or two-
byte wide data bus which oper-
ates in two handshaking
modes. The original data inter-
face and compressed data
interface use one- or two-byte
wide data buses which operate
in four asynchronous and one
synchronous handshaking
modes.
Samples
now
(C) IBM CORP. 1993, 1994. ALL RIGHTS RESERVED. USE IS FURTHER SUBJECT TO THE PROVISIONS ON THE BACK OF THE TITLE PAGE.
B-1
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