參數(shù)資料
型號: XC3SD1800A-4CSG484LI
廠商: Xilinx Inc
文件頁數(shù): 23/101頁
文件大?。?/td> 0K
描述: IC FPGA SPARTAN 3 DSP 484CSGBGA
標準包裝: 84
系列: Spartan®-3A DSP
LAB/CLB數(shù): 4160
邏輯元件/單元數(shù): 37440
RAM 位總計: 1548288
輸入/輸出數(shù): 309
門數(shù): 1800000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 484-FBGA,CSPBGA
供應商設備封裝: 484-CSPBGA
Spartan-3A DSP FPGA Family: DC and Switching Characteristics
DS610 (v3.0) October 4, 2010
Product Specification
28
Three-State Output Propagation Times
Table 24: Timing for the IOB Three-State Path
Symbol
Description
Conditions
Device
Speed Grade
Units
-5
-4
Max
Synchronous Output Enable/Disable Times
TIOCKHZ
Time from the active transition at the OTCLK
input of the Three-state Flip-Flop (TFF) to when
the Output pin enters the high-impedance state
LVCMOS25, 12 mA
output drive, Fast slew
rate
All
1.13
1.39
ns
TIOCKON(2)
Time from the active transition at TFF’s OTCLK
input to when the Output pin drives valid data
All
3.08
3.35
ns
Asynchronous Output Enable/Disable Times
TGTS
Time from asserting the Global Three State
(GTS) input on the STARTUP_SPARTAN3A
primitive to when the Output pin enters the
high-impedance state
LVCMOS25, 12 mA
output drive, Fast slew
rate
All
9.47
10.36
ns
Set/Reset Times
TIOSRHZ
Time from asserting TFF’s SR input to when the
Output pin enters a high-impedance state
LVCMOS25, 12 mA
output drive, Fast slew
rate
All
1.61
1.86
ns
TIOSRON(2)
Time from asserting TFF’s SR input at TFF to
when the Output pin drives valid data
All
3.57
3.82
ns
Notes:
1.
The numbers in this table are tested using the methodology presented in Table 26 and are based on the operating conditions set forth in
2.
This time requires adjustment whenever a signal standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the
data Output. When this is true, add the appropriate Output adjustment from Table 25.
相關PDF資料
PDF描述
XC3SD3400A-4FGG676I SPARTAN-3ADSP FPGA 3400K 676FBGA
XC4036XLA-09HQ240C IC FPGA C 2.5V 288 I/O 240HQFP
XC4062XL-09HQ240C IC FPGA C-TEMP 3.3V 240-HQFP
XC4085XL-3BG560I IC FPGA I-TEMP 3.3V 3SPD 560MBGA
XC4VLX100-10FFG1513C IC FPGA VIRTEX-4 100K 1513-FBGA
相關代理商/技術參數(shù)
參數(shù)描述
XC3SD1800A-4FG676C 制造商:Xilinx 功能描述:FPGA SPARTAN-3A 1.8M GATES 37440 CELLS 667MHZ 1.2V 676FBGA - Trays 制造商:Xilinx 功能描述:IC FPGA 519 I/O 676FBGA 制造商:Xilinx 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA
XC3SD1800A-4FG676I 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A DSP 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3SD1800A-4FGG676C 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A DSP 標準包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應商設備封裝:208-PQFP(28x28)
XC3SD1800A-4FGG676CES 制造商:Xilinx 功能描述:
XC3SD1800A-4FGG676I 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A DSP 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)