參數(shù)資料
型號： W25X16-VSFI
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 16M X 1 FLASH 2.7V PROM, PDSO16
封裝： 0.300 INCH, SOIC-16
文件頁數(shù)： 12/47頁
文件大小： 1317K
代理商： W25X16-VSFI
W25X16, W25X32, W25X64
- 2 -
Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
4.
PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5
5.
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
6.
PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM ............................... 6
7.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
8.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
8.1
Package Types ............................................................................................................... 8
8.2
Chip Select (/CS) ............................................................................................................ 8
8.3
Serial Data Output (DO) ................................................................................................. 8
8.4
Write Protect (/WP)......................................................................................................... 8
8.5
HOLD (/HOLD) ............................................................................................................... 8
8.6
Serial Clock (CLK) .......................................................................................................... 8
8.7
Serial Data Input / Output (DIO) ..................................................................................... 8
9.
BLOCK DIAGRAM ...................................................................................................................... 9
10.
FUNCTIONAL DESCRIPTION ................................................................................................. 10
10.1
SPI OPERATIONS ....................................................................................................... 10
10.1.1
SPI Modes ....................................................................................................................10
10.1.2
Dual Output SPI............................................................................................................10
10.1.3
Hold Function ...............................................................................................................10
10.2
WRITE PROTECTION.................................................................................................. 11
10.2.1
Write Protect Features..................................................................................................11
11.
CONTROL AND STATUS REGISTERS................................................................................... 12
11.1
STATUS REGISTER .................................................................................................... 12
11.1.1
BUSY............................................................................................................................12
11.1.2
Write Enable Latch (WEL) ............................................................................................12
11.1.3
Block Protect Bits (BP2, BP1, BP0)..............................................................................12
11.1.4
Top/Bottom Block Protect (TB) .....................................................................................12
11.1.5
Reserved Bits ...............................................................................................................12
11.1.6
Status Register Protect (SRP) ......................................................................................13
11.1.7
Status Register Memory Protection ..............................................................................14
11.2
INSTRUCTIONS ........................................................................................................... 16
11.2.1
Manufacturer and Device Identification.........................................................................16
11.2.2
Instruction Set
(1)...........................................................................................................17
11.2.3
Write Disable (04h) .......................................................................................................18
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相關代理商/技術參數(shù)
參數(shù)描述
W25X16VSFIG 功能描述:IC FLASH 16MBIT 75MHZ 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
W25X16VSFIG T&R 功能描述:IC FLASH 16MBIT 75MHZ 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
W25X16VSFIZ 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X16VSSI 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X16VSSIG 功能描述:IC FLASH 16MBIT 75MHZ 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
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