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參數(shù)資料
| 型號： | UPD16879GS-BGG |
| 廠商： | NEC Corp. |
| 英文描述： | MONOLITHIC QUAD H BRIDGE DRIVER CIRCUIT |
| 中文描述： | 單片四H橋驅動電路 |
| 文件頁數(shù)： | 30/32頁 |
| 文件大?。?/td> | 199K |
| 代理商： | UPD16879GS-BGG |
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Data Sheet S14188EJ1V0DS00
30
μ
PD16879
RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For soldering methods and conditions other than those recommended, consult NEC.
For details of the recommended soldering conditions, refer to information document
“Semiconductor Device
Mounting Technology Manual”
.
Soldering Method
Soldering Conditions
Recommended Condition
Infrared reflow
Package peak temperature: 235°C, Time: 30 secs max. (210°C min.); Number of
times: 3 times max.; Number of day: none; Flux: Rosin-based flux with little
chlorine content (chlorine: 0.2 Wt%, ax.) is recommended
IR35-00-3
VPS
Package peak temperature: 215°C, Time: 40 secs max. (200°C min.); Number of
times: 3 times max.; Number of day: none; Flux: Rosin-based flux with little
chlorine content (chlorine: 0.2 Wt%, ax.) is recommended.
VP15-00-3
Wave soldering
Package peak temperature: 260°C; Time: 10 secs max.; Preheating
temperature: 120°C max; Number of times: once; Flux: Rosin-based flux with
little chlorine content (chlorine: 0.2 Wt%, ax.) is recommended.
WS60-00-1
Caution Do not use two or more soldering methods in combination.
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