參數(shù)資料
型號(hào)： UAA1570HL
廠商： NXP SEMICONDUCTORS
元件分類： 通信及網(wǎng)絡(luò)
英文描述： Global Positioning System (GPS)baseband processor(通用定位系統(tǒng)基帶處理器)
中文描述： SPECIALTY TELECOM CIRCUIT, PQFP48
封裝： PLASTIC, SOT-313, LQFP-48
文件頁數(shù)： 74/76頁
文件大?。?/td> 890K
代理商： UAA1570HL
1999 May 10
74
Philips Semiconductors
Product specification
Global Positioning System (GPS) front-end
receiver circuit
UAA1570HL
17.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
18 DEFINITIONS
19 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
HLQFP, HSQFP, HSOP, SMS
PLCC
(3)
, SO
LQFP, QFP, TQFP
SQFP
SSOP, TSSOP, VSO
not suitable
(2)
suitable
not recommended
(3)(4)
not suitable
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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