參數(shù)資料
型號: TSB41LV03PFP
英文描述: IC APEX 20KE FPGA 600K 652-BGA
中文描述: 收發(fā)器
文件頁數(shù): 49/50頁
文件大?。?/td> 662K
代理商: TSB41LV03PFP
SLLS418G
JUNE 2000
REVISED JANUARY 2003
49
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
PFP (S-PQFP-G80)
PowerPAD
PLASTIC QUAD FLATPACK
40
Thermal Pad
(see Note D)
21
0,13 NOM
0,25
0,75
0,45
Seating Plane
4146925/A 01/98
Gage Plane
0,27
0,17
41
20
60
1
61
80
SQ
SQ
12,20
11,80
13,80
14,20
9,50 TYP
1,05
0,95
1,20 MAX
0,50
0,08
M
0,08
0
°
-7
°
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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