參數(shù)資料
型號(hào)： TLV4112CDGN
元件分類： TVS-瞬態(tài)抑制二極管
英文描述： Transient Voltage Suppressor Diodes
中文描述： 電壓反饋運(yùn)算放大器
文件頁(yè)數(shù)： 16/22頁(yè)
文件大?。?/td> 388K
代理商： TLV4112CDGN
TLV4110, TLV4111, TLV4112, TLV4113
FAMILY OF HIGH OUTPUT DRIVE OPERATIONAL
AMPLIFIERS WITH SHUTDOWN
SLOS289B – DECEMBER 1999 – REVISED DECEMBER 2000
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
TJ = 150
°
C
4
3
2
0
–55 –40
–10
TA – Free-Air Temperature –
°
C
20 35
M
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
65
95
125
1
–25
5
50
80
110
3.5
2.5
1.0
0.5
DGN Package
Low-K Test PCB
θ
JA = 52.7
°
C/W
PDIP Package
Low-K Test PCB
θ
JA = 104
°
C/W
SOIC Package
Low-K Test PCB
θ
JA = 176
°
C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 32. Maximum Power Dissipation vs Free-Air Temperature
The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the
device, especially muti-amplifier devices. Because these devices have linear output stages (Class A-B), most
of the heat dissipation is at low output voltages with high output currents.
The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The
PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a
copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other
hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around
the device,
θ
JA
decreases and the heat dissipation capability increases. The currents and voltages shown in
these graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output
currents and voltages should be used to choose the proper package.
相關(guān)PDF資料
PDF描述
TLV4112CDGNR Transient Voltage Suppressor Diodes
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLV4112CDGNG4 功能描述:運(yùn)算放大器 - 運(yùn)放 High-Output-Drive Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV4112CDGNR 制造商:Rochester Electronics LLC 功能描述:- Bulk
TLV4112CDR 制造商:Rochester Electronics LLC 功能描述:HIGH DRIVE,RRO,DUAL OP AMP - Bulk
TLV4112CP 功能描述:運(yùn)算放大器 - 運(yùn)放 High-Output-Drive Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV4112CPE4 功能描述:運(yùn)算放大器 - 運(yùn)放 High-Output-Drive Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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