參數(shù)資料
型號(hào)： TLV4112CDGN
元件分類： TVS-瞬態(tài)抑制二極管
英文描述： Transient Voltage Suppressor Diodes
中文描述： 電壓反饋運(yùn)算放大器
文件頁(yè)數(shù)： 14/22頁(yè)
文件大?。?/td> 388K
代理商： TLV4112CDGN
TLV4110, TLV4111, TLV4112, TLV4113
FAMILY OF HIGH OUTPUT DRIVE OPERATIONAL
AMPLIFIERS WITH SHUTDOWN
SLOS289B – DECEMBER 1999 – REVISED DECEMBER 2000
14
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations
The TLV411x is available in a thermally-enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 27(a) and Figure 27(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 27(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance
can be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 30. Views of Thermally Enhanced DGN Package
Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the
recommended approach.
68 mils x 70 mils) with 5 vias
(Via diameter = 13 mils
Thermal Pad Area
Single or Dual
Figure 31. PowerPAD PCB Etch and Via Pattern
相關(guān)PDF資料
PDF描述
TLV4112CDGNR Transient Voltage Suppressor Diodes
TLV4112CDR Transient Voltage Suppressor Diodes
TLV4112IDGNR Transient Voltage Suppressor Diodes
TLV4112IDR Voltage-Feedback Operational Amplifier
TLV4110CDR Transient Voltage Suppressor Diodes
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLV4112CDGNG4 功能描述:運(yùn)算放大器 - 運(yùn)放 High-Output-Drive Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV4112CDGNR 制造商:Rochester Electronics LLC 功能描述:- Bulk
TLV4112CDR 制造商:Rochester Electronics LLC 功能描述:HIGH DRIVE,RRO,DUAL OP AMP - Bulk
TLV4112CP 功能描述:運(yùn)算放大器 - 運(yùn)放 High-Output-Drive Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV4112CPE4 功能描述:運(yùn)算放大器 - 運(yùn)放 High-Output-Drive Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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