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13.2 ABSOLUTE MAXIMUM RATINGS
Stresses above those listed as “absolute maxi-
mum ratings” may cause permanent damage to
the device. This is a stress rating only and func-
tional operation of the device under these condi-
tions is not implied. Exposure to maximum rating
conditions for extended periods may affect device
reliability.
13.2.1 Voltage Characteristics
13.2.2 Current Characteristics
13.2.3 Thermal Characteristics
Notes:
1. Directly connecting the I/O pins to VDD or VSS could damage the device if an unexpected change of the I/O configura-
tion occurs (for example, due to a corrupted program counter). To guarantee safe operation, this connection must be done
through a pull-up or pull-down resistor (typical: 10k
for I/Os). Unused I/O pins must be tied in the same way to VDD or
VSS according to their reset configuration. For reset pin, please refer to Figure 64. 2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be
respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN>VDD
while a negative injection is induced by VIN<VSS.
3. All power (VDD) and ground (VSS) lines must always be connected to the external supply.
4. Negative injection disturbs the analog performance of the device. In particular, it induces leakage currents throughout
the device including the analog inputs. To avoid undesirable effects on the analog functions, care must be taken:
- Analog input pins must have a negative injection less than 0.8 mA (assuming that the impedance of the analog voltage
is lower than the specified limits)
- Pure digital pins must have a negative injection less than 1.6mA. In addition, it is recommended to inject the current as
far as possible from the analog input pins.
5. No negative current injection allowed on PB0 and PB1 pins.
6. When several inputs are submitted to a current injection, the maximum
ΣIINJ(PIN) is the absolute sum of the positive
and negative injected currents (instantaneous values). These results are based on characterization with
ΣIINJ(PIN) maxi-
mum current injection on four I/O port pins of the device.
Symbol
Ratings
Maximum value
Unit
VDD - VSS
Supply voltage
7.0
V
VIN
Input voltage on any pin1)2)
VSS - 0.3 to VDD +0.3
VESD(HBM)
Electrostatic discharge voltage (Human Body Model)
VESD(MM)
Electrostatic discharge voltage (Machine Model)
Symbol
Ratings
Maximum value
Unit
IVDD
Total current into VDD power lines (source)
3)
100
mA
IVSS
Total current out of VSS ground lines (sink)
3)
100
IIO
Output current sunk by any standard I/O and control pin
25
Output current sunk by any high sink I/O pin
50
Output current source by any I/Os and control pin
- 25
IINJ(PIN)
2)4)
Injected current on RESET pin
± 5
Injected current on PB0 and PB1 pins5)
+5
Injected current on any other pin6)
± 5
ΣIINJ(PIN)2)
Total injected current (sum of all I/O and control pins)6)
± 20
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
-65 to +150
°C
TJ
1