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參數(shù)資料
| 型號： | SC16C550IB48,128 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 1 CHANNEL(S), 3M bps, SERIAL COMM CONTROLLER, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 |
| 文件頁數(shù)： | 42/52頁 |
| 文件大小： | 639K |
| 代理商： | SC16C550IB48,128 |
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Philips Semiconductors
SC16C550
UART with 16-byte FIFO and IrDA encoder/decoder
Product data
Rev. 05 — 19 June 2003
47 of 52
9397 750 11619
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12. Soldering
12.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for ne pitch SMDs. In these situations reow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
12.2 Through-hole mount packages
12.2.1
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
12.2.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
12.3 Surface mount packages
12.3.1
Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°C (SnPb process) or below 245 °C (Pb-free process)
– for all the BGA and SSOP-T packages
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C550IN40 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C550IN40,112 | 功能描述:IC UART SINGLE W/FIFO 40-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - UART（通用異步接收器/發(fā)送器） 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 特點(diǎn):* 通道數(shù):2，DUART FIFO's:16 字節(jié) 規(guī)程:RS232，RS485 電源電壓:2.25 V ~ 5.5 V 帶并行端口:- 帶自動流量控制功能:是 帶IrDA 編碼器/解碼器:是 帶故障啟動位檢測功能:是 帶調(diào)制解調(diào)器控制功能:是 帶CMOS:是 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:托盤 其它名稱:XR16L2551IM-F-ND |
| SC16C554 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C554B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs |
| SC16C554B_10 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs |
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