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參數(shù)資料
| 型號(hào)： | S29GL512N |
| 廠商： | Spansion Inc. |
| 英文描述： | Replaced by PTB78560C : |
| 中文描述： | MirrorBit閃存系列 |
| 文件頁(yè)數(shù)： | 105/110頁(yè) |
| 文件大?。?/td> | 2624K |
| 代理商： | S29GL512N |
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May 13, 2004 27631A4
S29GLxxxN MirrorBitTM Flash Family
105
A d v a n c e I n f o r m a t i o n
Physical Dimensions
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
NOTES:
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
2
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
3
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
4
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
5
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
6
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
7
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
8
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3160\38.10A
MO-142 (B) EC
NOM.
---
---
1.00
0.95
0.17
0.17
0.10
0.10
TS 56
1.20
0.15
1.05
0.23
0.27
0.16
0.21
MAX.
---
0.05
MIN.
0.20
0.22
---
---
20.00
18.40
20.20
18.50
19.80
18.30
14.00
14.10
13.90
0.60
-
---
56
0.70
8
0.20
0.50
0
0.08
0.50 BASIC
E
e
L
R
N
b1
b
JEDEC
SYMBOL
A
A1
PACKAGE
A2
D1
D
c1
c
O
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