18
S29GL-A MirrorBit Flash Family
S29GL-A_00_A5 January 11, 2006
Prel imi n ary
Ordering Information–S29GL064A
S29GL064A Standard Products
Standard products are available in several packages and operating ranges. The
order number (Valid Combination) is formed by a combination of the following:
S29GL064A
90
T
A
I
R1
2
PACKING TYPE
0
= Tray
2
= 7-inch Tape and Reel
3
= 13-inch Tape and Reel
MODEL NUMBER
R1
= x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, highest address sector
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R3
= x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4
= x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address
sectors protected when WP#/ACC=VIL
R5
= x16, VCC=3.0 – 3.6 V, Uniform sector device
R6
= x16, VCC=3.0 – 3.6 V, Uniform sector device, highest address sector protected
when WP#=VIL
R7
= x16, VCC=3.0 – 3.6 V, Uniform sector device, lowest address sector protected
when WP#=VIL
R8
= x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, highest address sector
protected when WP#=VIL, TSO48 only
R9
= x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, lowest address sector
protected when WP#=VIL, TSO48 only
W1
= x16 VCC=2.7 – 3.6 V, 56-ball FBGA, Uniform sector device, highest address
sector protected when WP#/ACC=VIL *
W2
= x16 VCC=2.7 – 3.6 V, 56-ball FBGA, Uniform sector device, lowest address
sector protected when WP#/ACC=VIL *
W3
= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device *
W4
= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device *
*W1, W2, W3 and W4 are MCP-compatible packages for cellular handsets only
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL064A, 64 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBit Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 3. S29GL064A Valid Combinations
S29GL064A Valid Combinations
Package Description
Device Number Speed Option Package, Material &
Temperature Range
Model Number
Packing
Type
S29GL064A
90, 10, 11
TAI, TFI
R3, R4, R6, R7, R8, R9
0, 2, 3
TSOP
R1, R2
TSOP
BAI, BFI
R3, R4, R5
Fine-pitch BGA
FAI, FFI
R1, R2, R3, R4, R5
Fortified BGA
10, 11
BAI,BFI
W1, W2, W3, W4
Fine-Pitch BGA
(For cellular handsets only)
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types
0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part
number.
3. BGA package marking omits leading S29 and packing type designator from
ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be
supported in volume for this device. Consult your local
sales office to confirm availability of specific valid
combinations and to check on newly released
combinations.