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參數(shù)資料
| 型號： | PXA270 |
| 廠商： | Intel Corp. |
| 英文描述： | Electrical, Mechanical, and Thermal Specification |
| 中文描述： | 電氣，機械和熱規(guī)格 |
| 文件頁數(shù)： | 5/126頁 |
| 文件大?。?/td> | 1563K |
| 代理商： | PXA270 |
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Intel PXA270 Processor
Contents
Electrical, Mechanical, and Thermal Specification
v
6-1132-Bit Non-burst ROM, SRAM, or Flash Read Timing.....................................6-20
6-1232-Bit Burst-of-Eight ROM or Flash Read Timing............................................6-21
6-13Eight-Beat Burst Read from 16-Bit Burst-of-Four ROM or Flash Timing..........6-22
6-1416-bit ROM/Flash/SRAM Read for 4/2/1 Bytes Timing....................................6-23
6-15Synchronous Flash Burst-of-Eight Read Timing..............................................6-26
6-16Synchronous Flash Stacked Burst-of-Eight Read Timing................................6-27
6-17First-Access Latency Configuration Timing......................................................6-28
6-18Synchronous Flash Burst Read Example.........................................................6-30
6-1932-Bit Flash Write Timing.................................................................................6-31
6-2032-Bit Stacked Flash Write Timing...................................................................6-32
6-2116-Bit Flash Write Timing.................................................................................6-33
6-2232-Bit SRAM Write Timing ...............................................................................6-35
6-2316-bit SRAM Write for 4/2/1 Byte(s) Timing.....................................................6-36
6-2432-Bit VLIO Read Timing .................................................................................6-38
6-2532-Bit VLIO Write Timing..................................................................................6-39
6-26Expansion-Card Memory or I/O 16-Bit Access Timing.....................................6-41
6-27Expansion-Card Memory or I/O 16-Bit Access to 8-Bit Device Timing ............6-42
6-28LCD Timing Definitions.....................................................................................6-43
6-29SSP Master Mode Timing Definitions...............................................................6-44
6-30SSP Slave Mode Transmitting Data to an External Peripheral........................6-44
6-31SSP Slave Mode Receiving Data from External Peripheral.............................6-45
6-32JTAG Boundary-Scan Timing...........................................................................6-46
Tables
1-1 Supplemental Documentation............................................................................1-2
3-1 Processor Material Properties............................................................................3-7
4-1 Pin Usage Summary ........................................................................................4-10
4-2 Pin Usage and Mapping Notes.........................................................................4-27
4-3 Signal Types.....................................................................................................4-28
4-4 Memory Controller Pin Reset Values...............................................................4-28
4-5 Discrete (13x13 VF-BGA) Power Supply Pin Summary...................................4-29
5-1 Absolute Maximum Ratings................................................................................5-1
5-2 Voltage, Temperature, and Frequency Electrical Specifications........................5-2
5-3 Memory Voltage and Frequency Electrical Specifications .................................5-4
5-4 Core Voltage and Frequency Electrical Specifications.......................................5-4
5-5 Internally Generated Power Domain Descriptions .............................................5-6
5-6 Core Voltage Specifications For Lower Power Modes.......................................5-6
5-7 Power-Consumption Specifications....................................................................5-7
5-8 Standard Input, Output, and I/O Pin DC Operating Conditions..........................5-8
5-9 Typical 32.768-kHz Crystal Requirements.........................................................5-9
5-10 Typical External 32.768-kHz Oscillator Requirements....................................5-11
5-11Typical 13.000-MHz Crystal Requirements......................................................5-11
5-12Typical External 13.000-MHz Oscillator Requirements....................................5-12
5-13CLK_PIO Specifications...................................................................................5-12
5-14CLK_TOUT Specifications ...............................................................................5-12
5-1548 MHz Output Specifications..........................................................................5-13
6-1 Standard Input, Output, and I/O-Pin AC Operating Conditions..........................6-1
6-2 Power-On Timing Specifications (OSCC[CRI] = 0)............................................6-3
6-3 Hardware Reset Timing Specifications (OSCC[CRI] = 0) ..................................6-4
6-4 Hardware Reset Timing Specifications (OSCC[CRI] = 1) .................................6-5
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相關代理商/技術參數(shù) |
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| PXA300 | 制造商:Marvell 功能描述: |
| PXA310 | 制造商:MARVELL 制造商全稱:MARVELL 功能描述:Rich Multimedia with Scalable Performance up to 624 MHz for Cost-Effective and Power-Effi cient Secure 3.5G Smartphones |
| PXA320 | 制造商:MARVELL 制造商全稱:MARVELL 功能描述:Cost-Effective, Scalable Performance up to 806 MHz for Power-Efficient, High-End Multimedia Handsets, Embedded Solutions, and Enterprise-Class Devices |
| PXA6.3VC101MF60TP | 功能描述:鋁有機聚合物電容器 100UF 6.3V SMT CAN RoHS:否 制造商:Panasonic Electronic Components 電容:470 uF 容差:20 % 電壓額定值:2.5 V ESR:4.5 mOhms 工作溫度范圍:- 40 C to + 105 C 端接類型:SMD/SMT 外殼直徑: 外殼長度:7.3 mm 外殼寬度:4.3 mm 外殼高度:1.9 mm 封裝:Reel |
| PXA6.3VC471MH12TP | 制造商:United Chemi-Con Inc 功能描述:Cap Aluminum 470uF 6.3V 20% (8 X 12mm) SMD 0.012 Ohm 4770mA 2000 hr 105°C T/R |
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