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參數(shù)資料
| 型號(hào)： | PIC12F506 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 8/14-Pin, 8-Bit Flash Microcontroller |
| 中文描述： | 8/14-Pin，8位閃存微控制器 |
| 文件頁(yè)數(shù)： | 104/116頁(yè) |
| 文件大?。?/td> | 907K |
| 代理商： | PIC12F506 |
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PIC12F510/16F506
DS41268C-page 102
Preliminary
2007 Microchip Technology Inc.
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
NOM
14
.100 BSC
–
.130
–
.310
.250
.750
.130
.010
.060
.018
–
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
e
A
A2
A1
E
E1
D
L
c
b1
b
eB
–
.210
.195
–
.325
.280
.775
.150
.015
.070
.022
.430
.115
.015
.290
.240
.735
.115
.008
.045
.014
–
N
E1
D
NOTE 1
1
2
3
E
c
e
B
A2
L
A
A1
b1
b
e
Microchip Technology Drawing C04-005B
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