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參數(shù)資料
| 型號(hào)： | PCF8563 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Real-time clock/calendar(實(shí)時(shí)時(shí)鐘/日歷) |
| 中文描述： | 實(shí)時(shí)時(shí)鐘/日歷（實(shí)時(shí)時(shí)鐘/日歷） |
| 文件頁數(shù)： | 27/30頁 |
| 文件大?。?/td> | 676K |
| 代理商： | PCF8563 |
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Philips Semiconductors
PCF8563
Real-time clock/calendar
Product specification
16 April 1999
27 of 30
9397 750 04855
Philips Electronics N.V. 1999. All rights reserved.
14.4 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
[6]
15. Revision history
Table 31: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package
Soldering method
Wave
Reflow
[1]
Dipping
Through-hole
mount
Surface mount
DBS, DIP, HDIP, SDIP, SIL suitable
[2]
suitable
BGA, SQFP
HLQFP, HSQFP, HSOP,
HTSSOP, SMS
PLCC
[4]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
[3]
suitable
suitable
suitable
not recommended
[4] [5]
suitable
not recommended
[6]
suitable
suitable
Rev Date
01
CPCN
-
Description
This data sheet supersedes the version of 1998 Mar 25 (9397 750 03282):
990416
The format of this specification has been redesigned to comply with Philips Semiconductors’
new presentation and information standard
Added
Figure 3 “Device diode protection diagram.” on page 3
Added
Figure 4 “Voltage-low detection.” on page 5
Added paragraph in
Section 8.5 “Voltage-low detector and clock monitor” on page 5
Added
Figure 14
to
17 on page 18
in
Section 10
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCF8566 | Universal LCD driver for low multiplex rates |
| PCF8573 | Clock/calendar with Power Fail Detector |
| PCF8573P | Clock/calendar with Power Fail Detector |
| PCF8573T | Clock/calendar with Power Fail Detector |
| PCF8574 | Remote 8-bit I/O expander for I2C-bus |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8563_11 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563BS/4 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563BS/4,118 | 功能描述:實(shí)時(shí)時(shí)鐘 ULTRA LOW POWER RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| PCF8563BS/4-T | 功能描述:實(shí)時(shí)時(shí)鐘 ULTRA LOW POWER CLOCK CALENDAR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
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