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參數(shù)資料
| 型號： | PCF8563 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Real-time clock/calendar(實時時鐘/日歷) |
| 中文描述： | 實時時鐘/日歷（實時時鐘/日歷） |
| 文件頁數(shù)： | 26/30頁 |
| 文件大?。?/td> | 676K |
| 代理商： | PCF8563 |
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Philips Semiconductors
PCF8563
Real-time clock/calendar
Product specification
16 April 1999
26 of 30
9397 750 04855
Philips Electronics N.V. 1999. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
14.2.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
14.3 Through-hole mount packages
14.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°
C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
14.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
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PDF描述 |
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| PCF8566 | Universal LCD driver for low multiplex rates |
| PCF8573 | Clock/calendar with Power Fail Detector |
| PCF8573P | Clock/calendar with Power Fail Detector |
| PCF8573T | Clock/calendar with Power Fail Detector |
| PCF8574 | Remote 8-bit I/O expander for I2C-bus |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8563_11 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563BS/4 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563BS/4,118 | 功能描述:實時時鐘 ULTRA LOW POWER RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| PCF8563BS/4-T | 功能描述:實時時鐘 ULTRA LOW POWER CLOCK CALENDAR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
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