參數(shù)資料
型號： PCF8563
廠商： NXP Semiconductors N.V.
英文描述： Real-time clock/calendar(實時時鐘/日歷)
中文描述： 實時時鐘/日歷（實時時鐘/日歷）
文件頁數(shù)： 25/30頁
文件大小： 676K
代理商： PCF8563
Philips Semiconductors
PCF8563
Real-time clock/calendar
Product specification
16 April 1999
25 of 30
9397 750 04855
Philips Electronics N.V. 1999. All rights reserved.
14. Soldering
14.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. However, wave soldering is not always suitable for surface
mount ICs, or for printed-circuit boards with high population densities. In these
situations reflow soldering is often used.
14.2 Surface mount packages
14.2.1
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 230
°
C.
14.2.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
相關(guān)PDF資料
PDF描述
PCF8566 Universal LCD driver for low multiplex rates
PCF8573 Clock/calendar with Power Fail Detector
PCF8573P Clock/calendar with Power Fail Detector
PCF8573T Clock/calendar with Power Fail Detector
PCF8574 Remote 8-bit I/O expander for I2C-bus
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCF8563_11 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar
PCF8563BS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar
PCF8563BS/4 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-time clock/calendar
PCF8563BS/4,118 功能描述:實時時鐘 ULTRA LOW POWER RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
PCF8563BS/4-T 功能描述:實時時鐘 ULTRA LOW POWER CLOCK CALENDAR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*