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參數(shù)資料
| 型號： | PCF85103C-2 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | DRAM |
| 英文描述： | 256 x 8-bit CMOS EEPROM with I2C-bus interface |
| 中文描述： | 256 × 8位CMOS EEPROM，帶有I2C總線接口 |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 346K |
| 代理商： | PCF85103C-2 |
Philips Semiconductors
PCF85103C-2
256
×
8-bit CMOS EEPROM with I
2
C-bus interface
Product data
Rev. 02 — 09 May 2002
16 of 20
9397 750 09646
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
14.2.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
14.3 Through-hole mount packages
14.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°
C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
14.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF85103C-2_04 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF85103C2D | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS 電可擦除可編程只讀存儲器/I2C BUS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF85103C2N | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS 電可擦除可編程只讀存儲器/I2C BUS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF85103C-2P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF85103C-2P/00,11 | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
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