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參數(shù)資料
| 型號： | PCF85103C-2 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | DRAM |
| 英文描述： | 256 x 8-bit CMOS EEPROM with I2C-bus interface |
| 中文描述： | 256 × 8位CMOS EEPROM，帶有I2C總線接口 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 346K |
| 代理商： | PCF85103C-2 |
Philips Semiconductors
PCF85103C-2
256
×
8-bit CMOS EEPROM with I
2
C-bus interface
Product data
Rev. 02 — 09 May 2002
15 of 20
9397 750 09646
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
14. Soldering
14.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for fine pitch SMDs. In these situations reflow soldering is
recommended.
14.2 Surface mount packages
14.2.1
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 220
°
C for thick/large
packages, and below 235
°
C for small/thin packages.
14.2.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF85103C-2_04 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF85103C2D | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS 電可擦除可編程只讀存儲器/I2C BUS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF85103C2N | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS 電可擦除可編程只讀存儲器/I2C BUS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF85103C-2P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF85103C-2P/00,11 | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
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