參數(shù)資料
型號(hào): PC107AMGHU100LD
廠商: ATMEL CORP
元件分類(lèi): 外設(shè)及接口
英文描述: PCI Bridge Memory Controller
中文描述: MULTIFUNCTION PERIPHERAL, CBGA503
封裝: 33 X 33 MM, HITCE, CERAMIC, BGA-503
文件頁(yè)數(shù): 19/50頁(yè)
文件大小: 453K
代理商: PC107AMGHU100LD
19
PC107A [Preliminary]
2137C–HIREL–03/04
Internal Package Conduction
Resistance
For the PBGA packaging technology, the intrinsic conduction thermal resistance paths
are as follows:
The die junction-to-case thermal resistance,
The die junction-to-ball thermal resistance.
Figure 8 depicts the primary heat transfer path for a package with an attached heat sink
mounted to a printed-circuit board.
Figure 8.
C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Note:
The internal versus external package resistance
For this PBGA package, heat is dissipated from the component via several concurrent
paths. Heat is conducted through the silicon and may be removed to the ambient air by
convection and/or radiation. In addition, a second, parallel heat flow path exists by con-
duction in parallel through the C4 bumps and the epoxy under-fill, to the plastic
substrate for further convection cooling off the edges. Then from the plastic substrate,
heat is conducted via the leads/balls to the next-level interconnect (printed-circuit board)
whereupon the primary mode of heat transfer is by convection and/or radiation.
External Resistance
External Re sistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Die/Package
Package/Leads
Die Junction
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參數(shù)描述
PC107AMZFU100L 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PCI Bridge Memory Controller
PC107AMZFU100LC 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PCI Bridge Memory Controller
PC107AMZFU100LD 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PCI Bridge Memory Controller
PC107AVGHU100L 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PCI Bridge Memory Controller
PC107AVGHU100LC 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PCI Bridge Memory Controller