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參數(shù)資料
| 型號(hào)： | OR3T806PS240-DB |
| 廠商： | LATTICE SEMICONDUCTOR CORP |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 484 CLBS, 116000 GATES, PQFP240 |
| 封裝： | PLASTIC, SQFP2-240 |
| 文件頁(yè)數(shù)： | 157/203頁(yè) |
| 文件大?。?/td> | 1368K |
| 代理商： | OR3T806PS240-DB |
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Lattice Semiconductor
57
Data Sheet
November 2006
ORCA Series 3C and 3T FPGAs
Special Function Blocks (continued)
The external test (EXTEST) instruction allows the inter-
connections between ICs in a system to be tested for
opens and stuck-at faults. If an EXTEST instruction is
performed for the system shown in Figure 36, the con-
nections between U1 and U2 (shown by nets a, b, and
c) can be tested by driving a value onto the given nets
from one device and then determining whether the
same value is seen at the other device. This is deter-
mined by shifting 2 bits of data for each pin (one for the
output value and one for the 3-state value) through the
BSR until each one aligns to the appropriate pin. Then,
based upon the value of the 3-state signal, either the
I/O pad is driven to the value given in the BSR, or the
BSR is updated with the input value from the I/O pad,
which allows it to be shifted out TDO.
The SAMPLE/PRELOAD instruction is useful for sys-
tem debugging and fault diagnosis by allowing the data
at the FPGA’s I/Os to be observed during normal
operation or written during test operation. The data for
all of the I/Os is captured simultaneously into the BSR,
allowing them to be shifted-out TDO to the test host.
Since each I/O buffer in the PICs is bidirectional, two
pieces of data are captured for each I/O pad: the value
at the I/O pad and the value of the 3-state control sig-
nal. For preload operation, data is written from the BSR
to all of the I/Os simultaneously.
There are ve
ORCA-dened instructions. The PLC
scan rings 1 and 2 (PSR1, PSR2) allow user-dened
internal scan paths using the PLC latches/FFs. The
RAM_Write Enable (RAM_W) instruction allows the
user to serially congure the FPGA through TDI. The
RAM_Read Enable (RAM_R) allows the user to read
back RAM contents on TDO after conguration. The
IDCODE instruction allows the user to capture a 32-bit
identication code that is unique to each device and
serially output it at TDO. The IDCODE format is shown
in Table 14.
Table 14. Boundary-Scan ID Code
* PLC array size of FPGA, reverse bit order.
Note: Table assumes version 0.
Device
Version
(4 bits)
Part
*
(10 bits)
Family
(6 bits)
Manufacturer
(11 bits)
LSB
(1 bit)
OR3T20
0000
0011000000 110000
00000011101
1
OR3T30
0000
0111000000 110000
00000011101
1
OR3T55
0000
0100100000 110000
00000011101
1
OR3C/T80
0000
0110100000 110000
00000011101
1
OR3T125
0000
0011100000 110000
00000011101
1
Select
devices
have
been
discontinued.
See
Ordering
Information
section
for
product
status.
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| OR3T807PS240-DB | FPGA, 484 CLBS, 116000 GATES, PQFP240 |
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| OR3T55-4BA256 | FPGA, 324 CLBS, 40000 GATES, 80 MHz, PBGA256 |
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| OR3T55-4BA352 | FPGA, 324 CLBS, 40000 GATES, 80 MHz, PBGA352 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OR3T80-6PS240I | 制造商:AGERE 制造商全稱:AGERE 功能描述:3C and 3T Field-Programmable Gate Arrays |
| OR3T806PS240I-DB | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 3872 LUT 342 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR3T806S208-DB | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 Use LatticeEC RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR3T806S208I-DB | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 Use LatticeEC RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR3T80-7BA352 | 制造商:Lattice Semiconductor Corporation 功能描述:Field-Programmable Gate Array, 484 Cell, 352 Pin, Plastic, BGA |
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