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參數(shù)資料
| 型號： | NAND128W4A1AZA6T |
| 廠商： | NUMONYX |
| 元件分類： | PROM |
| 英文描述： | 8M X 16 FLASH 3V PROM, 10000 ns, PBGA55 |
| 封裝： | 8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-55 |
| 文件頁數(shù)： | 25/56頁 |
| 文件大小： | 882K |
| 代理商： | NAND128W4A1AZA6T |
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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
■
First Level Wear-leveling, new data is
programmed to the free blocks that have had
the fewest write cycles
■
Second Level Wear-leveling, long-lived data is
copied to another block so that the original
block can be used for more frequently-
changed data.
The Second Level Wear-leveling is triggered when
the difference between the maximum and the min-
imum number of write cycles per block reaches a
specific threshold.
Error Correction Code
An Error Correction Code (ECC) can be imple-
mented in the Nand Flash memories to identify
and correct errors in the data.
For every 2048 bits in the device it is recommend-
ed to implement 22 bits of ECC (16 bits for line par-
ity plus 6 bits for column parity).
An ECC model is available in VHDL or Verilog.
Contact the nearest ST Microelectronics sales of-
fice for more details.
Figure 24. Error Detection
Hardware Simulation Models
Behavioral simulation models. Denali Software
Corporation models are platform independent
functional models designed to assist customers in
performing entire system simulations (typical
VHDL/Verilog). These models describe the logic
behavior and timings of NAND Flash devices, and
so allow software to be developed before hard-
ware.
IBIS simulations models. IBIS (I/O Buffer Infor-
mation Specification) models describe the behav-
ior of the I/O buffers and electrical characteristics
of Flash devices.
These models provide information such as AC
characteristics, rise/fall times and package me-
chanical data, all of which are measured or simu-
lated at voltage and temperature ranges wider
than those allowed by target specifications.
IBIS models are used to simulate PCB connec-
tions and can be used to resolve compatibility is-
sues when upgrading devices. They can be
imported into SPICETOOLS.
New ECC generated
during read
XOR previous ECC
with new ECC
All results
= zero?
22 bit data = 0
YES
11 bit data = 1
NO
1 bit data = 1
Correctable
Error
ECC Error
No Error
ai08332
>1 bit
= zero?
YES
NO
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| NAND128W4A3AN6E | 8M X 16 FLASH 3V PROM, 10000 ns, PDSO48 |
| NAND128W4A1AV6 | 8M X 16 FLASH 3V PROM, 10000 ns, PDSO48 |
| NAND512R3M0BZBE | SPECIALTY MEMORY CIRCUIT, PBGA107 |
| NAND512W3A2SN6E | 64M X 8 FLASH 3V PROM, PDSO48 |
| NAND99R3M2AZBB5E | SPECIALTY MEMORY CIRCUIT, PBGA107 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NAND16GAH0HZA5E | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Trays |
| NAND16GAH0HZA5F | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Tape and Reel |
| NAND16GAHAPZO6E | 制造商:Micron Technology Inc 功能描述:AUTOMOTIVE - Trays |
| NAND16GW3B6DPA6E | 功能描述:IC FLASH 16GBIT 114LFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M（64M x 8） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
| NAND16GW3B6DPA6F | 功能描述:IC FLASH 16GBIT 114LFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M（64M x 8） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
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