參數(shù)資料
型號(hào): MT58L64V32P
廠商: Micron Technology, Inc.
英文描述: 64K x 32,Pipelined, SCD SyncBurst SRAM(2Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲(chǔ)器)
中文描述: 64K的× 32,流水線,SCD的SyncBurst的SRAM(處理器,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲(chǔ)器)
文件頁數(shù): 17/25頁
文件大?。?/td> 487K
代理商: MT58L64V32P
17
2Mb: 128K x 18, 64K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L128L18P_2.p65 – Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
2Mb: 128K x 18, 64K x 32/36
PIPELINED, SCD SYNCBURST SRAM
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(Note 1) (0°C
T
A
+70°C; V
DD
= +3.3V +0.3V/-0.165V)
-5
-6
-7.5
-10
DESCRIPTION
Clock
Clock cycle time
Clock frequency
Clock HIGH time
Clock LOW time
Output Times
Clock to output valid
Clock to output invalid
Clock to output in Low-Z
Clock to output in High-Z
OE# to output valid
OE# to output in Low-Z
OE# to output in High-Z
Setup Times
Address
Address status (ADSC#, ADSP#)
Address advance (ADV#)
Write signals
(BWa#-BWd#, BWE#, GW#)
Data-in
Chip enables (CE#, CE2#, CE2)
Hold Times
Address
Address status (ADSC#, ADSP#)
Address advance (ADV#)
Write signals
(BWa#-BWd#, BWE#, GW#)
Data-in
Chip enables (CE#, CE2#, CE2)
SYMBOL
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
NOTES
t
KC
f
KF
t
KH
t
KL
5.0
6.0
7.5
10
ns
200
166
133
100
MHz
ns
ns
1.6
1.6
1.7
1.7
1.9
1.9
3.2
3.2
2
2
t
KQ
t
KQX
t
KQLZ
t
KQHZ
t
OEQ
t
OELZ
t
OEHZ
3.5
3.5
4.0
5.0
ns
ns
ns
ns
ns
ns
ns
1.0
0
1.5
1.5
1.5
1.5
1.5
1.5
3
3, 4, 5, 6
3, 4, 5, 6
7
3, 4, 5, 6
3, 4, 5, 6
3.5
3.5
3.5
3.5
4.0
4.0
5.0
5.0
0
0
0
0
3.0
3.5
4.0
4.5
t
AS
t
ADSS
t
AAS
t
WS
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
2.2
2.2
2.2
2.2
ns
ns
ns
ns
8, 9
8, 9
8, 9
8, 9
t
DS
t
CES
1.5
1.5
1.5
1.5
1.5
1.5
2.2
2.2
ns
ns
8, 9
8, 9
t
AH
t
ADSH
t
AAH
t
WH
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
ns
ns
8, 9
8, 9
8, 9
8, 9
t
DH
t
CEH
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
8, 9
8, 9
NOTE:
1. Test conditions as specified with the output loading shown in Figure 1 for 3.3V I/O (V
DD
Q = +3.3V +0.3V/-0.165V) and
Figure 3 for 2.5V I/O (V
DD
Q = +2.5V +0.4V/-0.125V) unless otherwise noted.
2. Measured as HIGH above V
IH
and LOW below V
IL
.
3. This parameter is measured with the output loading shown in Figure 2 for 3.3V I/O and Figure 4 for 2.5V I/O.
4. This parameter is sampled.
5. Transition is measured ±500mV from steady state voltage.
6. Refer to Technical Note TN-58-09, “ Synchronous SRAM Bus Contention Design Considerations,” for a more thorough
discussion on these parameters.
7. OE# is a “ Don’t Care” when a byte write enable is sampled LOW.
8. A WRITE cycle is defined by at least one byte write enable LOW and ADSP# HIGH for the required setup and hold times.
A READ cycle is defined by all byte write enables HIGH and ADSC# or ADV# LOW or ADSP# LOW for the required setup
and hold times.
9. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK
when either ADSP# or ADSC# is LOW and chip enabled. All other synchronous inputs must meet the setup and hold
times with stable logic levels for all rising edges of clock (CLK) when the chip is enabled. Chip enable must be valid at
each rising edge of CLK when either ADSP# or ADSC# is LOW to remain enabled.
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