參數(shù)資料
型號: MT58L32L32F
廠商: Micron Technology, Inc.
英文描述: 32K x 32, 3.3V I/O, Flow-Through SyncBurst SRAM(1Mb,3.3V輸入/輸出,流通式同步脈沖靜態(tài)RAM)
中文描述: 32K的× 32,3.3V的I / O的流量通過SyncBurst的SRAM(1兆,3.3V的輸入/輸出,流通式同步脈沖靜態(tài)內(nèi)存)
文件頁數(shù): 6/17頁
文件大小: 327K
代理商: MT58L32L32F
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Flow-Through SyncBurst SRAM
MT58L64L18F.p65 – Rev. 9/99
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1999, Micron Technology, Inc.
6
1Mb: 64K x 18, 32K x 32/36
3.3V I/O, FLOW-THROUGH SYNCBURST SRAM
TQFP PIN DESCRIPTIONS (continued)
x18
85
x32/x36
85
SYMBOL
ADSC#
TYPE
Input
DESCRIPTION
Synchronous Address Status Controller: This active LOW input
interrupts any ongoing burst, causing a new external address to be
registered. A READ or WRITE is performed using the new address if
CE# is LOW. ADSC# is also used to place the chip into power-down
state when CE# is HIGH.
Mode: This input selects the burst sequence. A LOW on this pin
selects “l(fā)inear burst.” NC or HIGH on this pin selects “interleaved
burst.” Do not alter input state while device is operating.
Snooze Enable: This active HIGH, asynchronous input causes the
device to enter a low-power standby mode in which all data in the
memory array is retained. When ZZ is active, all other inputs are
ignored.
Input/ SRAM Data I/Os: For the x18 version, Byte “a” is DQa pins; Byte “b”
Output is DQb pins. For the x32 and x36 versions, Byte “a” is DQa pins;
Byte “b” is DQb pins; Byte “c” is DQc pins; Byte “d” is DQd pins.
Input data must meet setup and hold times around the rising edge
of CLK.
31
31
MODE
Input
64
64
ZZ
Input
(a)
58, 59,
62, 63, 68, 69, 56-59, 62, 63
72, 73
(b)
8, 9, 12,
13, 18, 19, 22, 72-75, 78, 79
23
(a)
52, 53,
DQa
(b)
68, 69,
DQb
(c)
2, 3, 6-9,
12, 13
(d) 18, 19,
22-25, 28, 29
51
80
1
30
DQc
DQd
74
24
NC/
DQPa
NC/
DQPb
NC/
DQPc
NC/
DQPd
V
DD
NC/
I/O
No Connect/Parity Data I/Os: On the x32 version, these pins are No
Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte “b”
parity is DQPb. On the x36 version, Byte “a” parity is DQPa; Byte
“b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity is DQPd.
Supply Power Supply:
See DC Electrical Characteristics and Operating
Conditions for range.
Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and
Operating Conditions for range.
Supply Ground:
GND.
15, 41, 65, 91 15, 41, 65, 91
4, 11, 20, 27,
54, 61, 70, 77 54, 61, 70, 77
5, 10, 14, 17,
21, 26, 40, 55, 21, 26, 40, 55,
60, 67, 71, 76, 60, 67, 71, 76,
90
38, 39, 42, 43 38, 39, 42, 43
4, 11, 20, 27,
V
DD
Q
5, 10, 14, 17,
V
SS
90
DNU
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and may be
connected to ground to improve package heat dissipation.
1-3, 6, 7, 16,
25, 28-30,
51-53, 56, 57,
66, 75, 78, 79,
95, 96
49, 50
16, 66
NC
49, 50
NC/
SA
No Connect: These pins are reserved for address expansion.
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