參數(shù)資料
型號: MT6V16M16
廠商: Micron Technology, Inc.
英文描述: 512K x 16 x 32 banks RDRAM(512K x 16 x 32組 同步動態(tài)RAM)
中文描述: 為512k × 16 × 32銀行的RDRAM(為512k × 16 × 32組同步動態(tài)RAM)的
文件頁數(shù): 1/4頁
文件大小: 83K
代理商: MT6V16M16
1
256Mb/288Mb: 16 Meg x 16/18 RDRAM
256MRDRAM_2.p65 – Rev. 7/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
256Mb/288Mb: 16 MEG x 16/18
RDRAM
ADVANCE
RDRAM
PART NUMBERS
CLK FREQ.
(MHz)
300
356
356
400
400
300
356
356
400
400
ACCESS
TIME (ns)
53
50
45
45
40
53
50
45
45
40
PART NUMBER
MT6V16M16F2-3M
MT6V16M16F2-3B
MT6V16M16F2-3C
MT6V16M16F2-4C
MT6V16M16F2-4D
MT6V16M18F2-3M
MT6V16M18F2-3B
MT6V16M18F2-3C
MT6V16M18F2-4C
MT6V16M18F2-4D
ORGANIZATION
1
512K x 16 x 32
512K x 16 x 32
512K x 16 x 32
512K x 16 x 32
512K x 16 x 32
512K x 18 x 32
512K x 18 x 32
512K x 18 x 32
512K x 18 x 32
512K x 18 x 32
NOTE
: 1. The “x32” designation indicates that this RDRAM
core is comprised of 32 banks which use a “split”
bank architecture.
MT6V16M16 - 512K x 16 x 32 banks
MT6V16M18 - 512K x 18 x 32 banks
site:
www.micronsemi.com/datasheets/datasheet.html
RAMBUS
DRAM
FEATURES
High-speed 300 MHz, 356 MHz, and 400 MHz
clocks with 2x data rates
1.6 GB/s peak I/O bandwidth
Rambus
signaling level (RSL) using differential
300 MHz, 356 MHz, and 400 MHz transmit and
receive clocks
Packet-oriented Rambus protocol transmitted in
8-bit-long packets
Separate control (8-bit) and data (18-bit) buses for
increased data bandwidth capability
Control bus with separate row (3-bit) and column
(5-bit) buses for easier command scheduling
Programmable output delay timing for roundtrip
delay of one to five cycles
Support for up to four simultaneous transactions
(within bank restrictions)
Write buffer to reduce READ latency
Three precharge mechanisms for controller
flexibility
Programmable power states for flexibility in power
consumption versus data access time
Power-down Self-Refresh and Active Refresh
Organization: 2KB pages and 32 banks, x16 or x18
FBGA package
Interleaved Data Mode (IDM) on the MT6V16M18
for system level error correction
32ms, 16,384 cycle refresh
2.5V power supply with 1.8V CMOS supply for I/Os
OPTIONS
Configurations
16 Meg x 16
16 Meg x 18
NUMBER
16M16
16M18
Package
FBGA
(84-pin, 2-row depopulated pinout)
F2
Timing (Cycle Time)
300 MHz Clock Rate, Access Time = 53ns
356 MHz Clock Rate, Access Time = 50ns
356 MHz Clock Rate, Access Time = 45ns
400 MHz Clock Rate, Access Time = 45ns
400 MHz Clock Rate, Access Time = 40ns
-3M
-3B
-3C
-4C
-4D
Part Number Example:
MT6V16M16F2-3B
84-PIN FBGA
(TOP VIEW)
相關(guān)PDF資料
PDF描述
MT6V16M18 512K x 18 x 32 banks RDRAM(512K x 18 x 32組 同步動態(tài)RAM)
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