參數(shù)資料
型號: MT58L256L18P1
廠商: Micron Technology, Inc.
英文描述: 256K x 18,Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
中文描述: 256 × 18,流水線,SCD的SyncBurst的SRAM(4MB,在流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
文件頁數(shù): 1/28頁
文件大?。?/td> 445K
代理商: MT58L256L18P1
1
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L256L18P1_2.p65 – Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
PRELIMINARY
FEATURES
Fast clock and OE# access times
Single +3.3V +0.3V/-0.165V power supply (V
DD
)
Separate +3.3V or +2.5V isolated output buffer
supply (V
DD
Q)
SNOOZE MODE for reduced-power standby
Single-cycle deselect (Pentium
BSRAM-compat-
ible)
Common data inputs and data outputs
Individual BYTE WRITE control and GLOBAL
W RITE
Three chip enables for simple depth expansion
and address pipelining
Clock-controlled and registered addresses, data
I/Os and control signals
Internally self-timed WRITE cycle
Burst control pin (interleaved or linear burst)
Automatic power-down for portable applications
165-pin FBGA package
100-pin TQFP package
Low capacitive bus loading
x18, x32, and x36 versions available
OPTIONS
Timing (Access/Cycle/MHz)
2.3ns/4ns/250 MHz
2.6ns/4.4ns/225 MHz
3.1ns/5ns/200 MHz
3.5ns/6ns/166 MHz
4.0ns/7.5ns/133 MHz
5ns/10ns/100 MHz
Configurations
3.3V I/O
256K x 18
128K x 32
128K x 36
2.5V I/O
256K x 18
128K x 32
128K x 36
Packages
100-pin TQFP
165-pin FBGA
Operating Temperature Range
Commercial (0°C to +70°C)
Part Number Example:
*A Part Marking Guide for the FBGA devices can be found on Micron’shttp://www.micronsemi.com/support/index.html
相關(guān)PDF資料
PDF描述
MT58L256V18P1 256K x 18,Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
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