參數(shù)資料
型號(hào): MT49H32M9CFM-xx
廠商: Micron Technology, Inc.
英文描述: 288Mb SIO REDUCED LATENCY(RLDRAM II)
中文描述: 288Mb二氧化硅約化延遲(延遲DRAM二)
文件頁(yè)數(shù): 10/44頁(yè)
文件大小: 1117K
代理商: MT49H32M9CFM-XX
16 MEG x 18, 32 MEG x 9
2.5V V
EXT
, 1.8V V
DD
, HSTL, SIO, RLDRAM II
pdf: 09005aef80a41b59/zip: 09005aef811ba111
MT49H8M18C_2.fm - Rev. F 11/04 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
10
Commands
According to the functional signal description, the
following command sequences are possible. All input
states or sequences not shown are illegal or reserved.
All command and address inputs must meet setup and
hold times around the rising edge of CK.
NOTE:
1. X represents a “Don’t Care”; H represents a logic HIGH; L represents a logic LOW; A represents a valid address; and BA
represents a valid bank address.
2. Only A[17:0] are used for the MRS command.
3. See Table 3 above.
V
DD
Q
Supply
DQ Power Supply: Nominally, 1.5V or 1.8V. Isolated on the device for improved noise
immunity. See Table 19: “DC Electrical Characteristics and Operating Conditions” on
page 41 for range.
Ground.
DQ Ground: Isolated on the device for improved noise immunity.
Power Supply: Isolated Termination Supply. Nominally, V
DD
Q/2. See Table 19, DC
Electrical Characteristics and Operating Conditions, on page 41 for range.
No Function: These balls may be connected to ground.
Do Not Use: These balls may be connected to ground.
V
SS
V
SS
Q
V
TT
Supply
Supply
Supply
NF
DNU
Table 2:
Ball Descriptions (continued)
SYMBOL
TYPE
DESCRIPTION
Table 3:
Address Widths at Different
Burst Lengths
BURST LENGTH
CONFIGURATION
x18
19:0
18:0
17:0
x9
20:0
19:0
18:0
BL = 2
BL = 4
BL = 8
Table 4:
Command Table
1
OPERATION
CODE
DESEL/NOP
MRS
READ
WRITE
AREF
CS#
H
L
L
L
L
WE#
X
L
H
L
H
REF#
X
L
H
H
L
A(20:0)
X
OPCODE
A
A
X
B(2:0)
X
X
BA
BA
BA
NOTES
Device DESELECT/No Operation
MRS: Mode Register Set
READ
WRITE
AUTO REFRESH
2
3
3
相關(guān)PDF資料
PDF描述
MT4C1004J 4 Meg x 1 FPM DRAM(4 M x 1快速頁(yè)面模式動(dòng)態(tài)RAM)
MT4C4001STG-6 standard or self refresh
MT4C4001STG-7 standard or self refresh
MT4C4001STG-8 standard or self refresh
MT4C4001JDJ-6 standard or self refresh
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MT49H32M9CHU-25 制造商:Micron Technology Inc 功能描述:DRAM CHIP RLDRAM 288MBIT 1.8V 144FBGA - Trays
MT49H32M9CHU-33 制造商:Micron Technology Inc 功能描述:32MX9 RLDRAM PLASTIC FBGA 1.8V SEPARATE I/O 8 BANKS 1.8V I/O - Trays
MT49H32M9CHU-5 制造商:Micron Technology Inc 功能描述:32MX9 RLDRAM PLASTIC FBGA 1.8V SEPARATE I/O 8 BANKS 1.8V I/O - Trays
MT49H32M9FM-25 制造商:Micron Technology Inc 功能描述:
MT49H32M9FM-25 TR 功能描述:IC RLDRAM 288MBIT 400MHZ 144FBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 產(chǎn)品變化通告:Product Discontinuation 05/Nov/2008 標(biāo)準(zhǔn)包裝:84 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SRAM - 同步 ZBT 存儲(chǔ)容量:4.5M(128K x 36) 速度:75ns 接口:并聯(lián) 電源電壓:3.135 V ~ 3.465 V 工作溫度:-40°C ~ 85°C 封裝/外殼:119-BGA 供應(yīng)商設(shè)備封裝:119-PBGA(14x22) 包裝:托盤 其它名稱:71V3557SA75BGI