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256Mb: x4, x8, x16 SDRAM
256MSDRAM_E.p65
–
Rev. E; Pub. 3/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2002, Micron Technology, Inc.
256Mb: x4, x8, x16
SDRAM
CROSS REFERENCE FOR FBGA DEVICE MARKING
ENGINEERING
SAMPLE
ZBHBF
ZBHBN
ZBHCF
ZBHCN
ZWHDF
ZWHDN
PRODUCTION
MARKING
DBHBF
DBHBN
DBHCF
DBHCN
DWHDF
DWHDN
PART NUMBER
MT48LC64M4A2FB-75
MT48LC64M4A2FB-7E
MT48LC32M8A2FB-75
MT48LC32M8A2FB-7E
MT48LC16M16A2FG-75
MT48LC16M16A2FG-7E
ARCHITECTURE
64 Meg x 4
64 Meg x 4
32 Meg x 8
32 Meg x 8
16 Meg x 16
16 Meg x 16
FBGA
60-ball, 8x16mm
60-ball, 8x16mm
60-ball, 8x16mm
60-ball, 8x16mm
54-ball, 8x14mm
54-ball, 8x14mm
FBGA DEVICE MARKING
Due to the size of the package, Micron’s standard
part number is not printed on the top of each device.
Instead, an abbreviated device mark comprised of a
five-digit alphanumeric code is used. The abbreviated
device marks are cross referenced to Micron part num-
bers in Table 1.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
DBFCF
Speed Grade
F = -75
N = -7E
Width ( I/Os)
B = x4
C = x8
D = x16
Device Density
H = 256Mb
Product Type
B = 3.3V SDR SDRAM (60-ball, "FB", 8mm x 16mm)
W = 3.3V SDR SDRAM (54-ball, "FG", 8mm x 14mm)
Product Group
D = DRAM
Z = DRAM ENGINEERING SAMPLE