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ADVANCE
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE
BY MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.
1
512Mb: x4, x8, x16
SDRAM
512Mb: x4, x8, x16 SDRAM
512MSDRAM_D.p65 – Rev. D; Pub 1/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
KEY TIMING PARAMETERS
SPEED
GRADE
-7E
-75
-7E
-75
CLOCK
FREQUENCY CL = 2* CL = 3*
143 MHz
133 MHz
133 MHz
100 MHz
ACCESS TIME
SETUP
TIME
1.5ns
1.5ns
1.5ns
1.5ns
HOLD
TIME
0.8ns
0.8ns
0.8ns
0.8ns
–
–
5.4ns
5.4ns
–
–
5.4ns
6ns
128 Meg x 4
32 Meg x 4 x 4 banks 16 Meg x 8 x 4 banks 8 Meg x 16 x 4 banks
8K
8K
8K (A0–A12)
8K (A0–A12)
4 (BA0, BA1)
4 (BA0, BA1)
Column Addressing 4K (A0–A9, A11, A12)
64 Meg x 8
32 Meg x 16
Configuration
Refresh Count
Row Addressing
Bank Addressing
8K
8K (A0–A12)
4 (BA0, BA1)
1K (A0–A9)
2K (A0–A9, A11)
SYNCHRONOUS
DRAM
MT48LC128M4A2 – 32 Meg x 4
MT48LC64M8A2 – 16 Meg x 8
MT48LC32M16A2 – 8 Meg x 16 x 4 banks
For the latest data sheet, please refer to the Micron Web site:
x 4 banksx 4 banks
Pin Assignment (Top View)
54-Pin TSOP
FEATURES
PC100- and PC133-compliant
Fully synchronous; all signals registered on positive
edge of system clock
Internal pipelined operation; column address can be
changed every clock cycle
Internal banks for hiding row access/precharge
Programmable burst lengths: 1, 2, 4, 8, or full page
Auto Precharge, includes CONCURRENT AUTO
PRECHARGE, and Auto Refresh Modes
Self Refresh Mode
64ms, 8,192-cycle refresh
LVTTL-compatible inputs and outputs
Single +3.3V ±0.3V power supply
OPTIONS
Configurations
128 Meg x 4
64 Meg x 8
32 Meg x 16
WRITE Recovery (
t
WR)
t
WR = “2 CLK”
1
Plastic Package – OCPL
2
54-pin TSOP II (400 mil)
Timing (Cycle Time)
7.5ns @ CL = 2 (PC133)
7.5ns @ CL = 3 (PC133)
Self Refresh
Standard
Low power
Operating Temperature
Commercial (0
o
C to +70
o
C)
MARKING
(32 Meg x 4 x 4 banks)
(16 Meg x 8 x 4 banks)
(8 Meg x 16 x 4 banks)
128M4
64M8
32M16
A2
TG
-7E
-75
None
L
None
NOTE:
1. Refer to Micron Technical Note TN-48-05.
2. Off-center parting line.
Part Number Example:
MT48LC32M16A2TG-75
NOTE:
The # symbol indicates signal is active LOW. A dash
(–) indicates x8 and x4 pin function is same as x16
pin function.
V
DD
DQ0
V
DD
Q
DQ1
DQ2
VssQ
DQ3
DQ4
V
DD
Q
DQ5
DQ6
VssQ
DQ7
V
DD
DQML
WE#
CAS#
RAS#
CS#
BA0
BA1
A10
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
Vss
DQ15
VssQ
DQ14
DQ13
V
DD
Q
DQ12
DQ11
VssQ
DQ10
DQ9
V
DD
Q
DQ8
Vss
NC
DQMH
CLK
CKE
A12
A11
A9
A8
A7
A6
A5
A4
Vss
x8
-
DQ7
-
NC
DQ6
-
NC
DQ5
-
NC
DQ4
-
NC
-
-
DQM
-
-
-
-
-
-
-
-
-
-
-
x16
x16
x8
-
DQ0
-
NC
DQ1
-
NC
DQ2
-
NC
DQ3
-
NC
-
NC
-
-
-
-
-
-
-
-
-
-
-
-
x4
-
NC
-
NC
DQ3
-
NC
NC
-
NC
DQ2
-
NC
-
-
DQM
-
-
-
-
-
-
-
-
-
-
-
x4
-
NC
-
NC
DQ0
-
NC
NC
-
NC
DQ1
-
NC
-
NC
-
-
-
-
-
-
-
-
-
-
-
-
*CL = CAS (READ) latency
512Mb SDRAM PART NUMBERS
PART NUMBER
MT48LC128M4A2TG
MT48LC64M8A2TG
MT48LC32M16A2TG
ARCHITECTURE
128 Meg x 4
64 Meg x 8
32 Meg x 16