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參數(shù)資料
| 型號： | MPE603ERX100LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 21/32頁 |
| 文件大小： | 250K |
| 代理商： | MPE603ERX100LX |
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PID6-603e Hardware Specifications, Rev 2
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 14). This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers
the best thermal performance, considering the low interface pressure. Of course, the selection of any thermal
interface material depends on many factors—thermal performance requirements, manufacturability, service
temperature, dielectric properties, cost, etc.
Figure 16. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
0
0.5
1
1.5
2
0
1 02 0
3 04 05 06 07 08 0
Graphite/Oil Sheet (0.005 inch)
Silicone Sheet (0.006 inch)
Floroether Oil Sheet (0.007 inch)
Synthetic Grease
Bare Joint
Specific
Thermal
Resistance
(Kin
2
/W)
Contact Pressure
(psi)
Contact Pressure (psi)
Specific
Thermal
Resistance
(Kin
2
/W)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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