- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45375 > MPE603ERX100LX (FREESCALE SEMICONDUCTOR INC) 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 PDF資料下載
參數(shù)資料
| 型號： | MPE603ERX100LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 19/32頁 |
| 文件大?。?/td> | 250K |
| 代理商： | MPE603ERX100LX |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁當(dāng)前第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁
26
PID6-603e Hardware Specifications, Rev 2
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 KOhms)
pull-up resistors or restored in some manner by the system. The snooped address and transfer attribute inputs
are—A[0–31], AP[0–3], TT[0–4], TBST, TSIZ[0–2], and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management information for the ceramic quad-at package (CQFP) and the
ceramic ball grid array (CBGA) package for air-cooled applications. Proper thermal control design is
primarily dependent upon the system-level design—the heat sink, airow and thermal interface material. To
reduce the die-junction temperature, heat sinks may be attached to the package by several methods—
adhesive, spring clip to holes in the printed-circuit board or package, and mounting clip and screw assembly
(CBGA package); see Figure 14. This spring force should not exceed 5.5 pounds of force.
Figure 14. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the 603e. There are several
commercially-available heat sinks for the 603e provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Adhesive
WB/C4-CQFP Package
or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPE603EFE100TX | 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 |
| MPE603ERX100LX | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| MPE603PFE200LX | 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 |
| MPE603PRX200LX | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| MPE603PFE166LX | 32-BIT, 167 MHz, RISC PROCESSOR, CQFP240 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPE603ERX133LN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPE603RRX200LC | 制造商:Freescale Semiconductor 功能描述: |
| MPE603RRX266LC | 制造商:Motorola Inc 功能描述: |
| MPE-60S | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Single Output, 60W Compact, Enclosed AC/DC Power Supplies |
| MPE-60S-05 | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Single Output, 60W Compact, Enclosed AC/DC Power Supplies |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。