參數(shù)資料
型號(hào): mPD705101
廠商: NEC Corp.
英文描述: V831TM 32-BIT MICROPROCESSOR
中文描述: V831TM 32位微處理器
文件頁(yè)數(shù): 66/72頁(yè)
文件大?。?/td> 302K
代理商: MPD705101
μ
PD705101
66
18. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD705101.
For details of the recommended soldering conditions, refer to our document
Semiconductor Device Mounting
Technology Manual
(C10535E)
.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 18-1. Soldering Conditions for Surface-Mount Devices
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65 % or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering Process
Infrared ray reflow
VPS
Partial heating method
Symbol
IR35-103-2
VP15-103-2
Soldering Conditions
Peak package’s surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Peak package’s surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
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