參數(shù)資料
型號: MPC8308CZQAFD
廠商: Freescale Semiconductor
文件頁數(shù): 13/83頁
文件大小: 0K
描述: MPU POWERQUICC II PRO 473MAPBGA
標(biāo)準(zhǔn)包裝: 84
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 333MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 473-LFBGA
供應(yīng)商設(shè)備封裝: 473-MAPBGA(19x19)
包裝: 托盤
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
20
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
This figure shows the RGMII AC timing and multiplexing diagrams.
Figure 11. RGMII AC Timing and Multiplexing Diagrams
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for MII
GTX_CLK125 reference clock period
tG12
6
—8.0
ns
GTX_CLK125 reference clock duty cycle
tG125H/tG125
47
53
%
Notes:
1. In general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII timing.
For example, the subscript of tRGT represents the RGMII receive (RX) clock. Note also that the notation for rise (R) and fall
(F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is skew (SK)
followed by the clock that is being skewed (RGT).
2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is
added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
5. Duty cycle reference is 0.5*LVDD
6. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention.
Table 25. RGMII AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 2.5 V ± 5%.
GTX_CLK
tRGT
tRGTH
tSKRGT
TX_CTL
TXD[8:5]
TXD[7:4]
TXD[9]
TXERR
TXD[4]
TXEN
TXD[3:0]
(At Transmitter)
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CLK
(At PHY)
RX_CTL
RXD[8:5]
RXD[7:4]
RXD[9]
RXERR
RXD[4]
RXDV
RXD[3:0]
RXD[8:5][3:0]
RXD[7:4][3:0]
RX_CLK
(At PHY)
tSKRGT
相關(guān)PDF資料
PDF描述
IDT7034L20PFI8 IC SRAM 72KBIT 20NS 100TQFP
MPC8309VMAGDCA IC PROCESSOR E300 489MAPBGA
MPC8309CVMADDCA IC PROCESSOR E300 489MAPBGA
ASM43DTAD CONN EDGECARD 86POS R/A .156 SLD
MPC8308ZQAGD MPU POWERQUICC II PRO 473MAPBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8308CZQAFDA 功能描述:微處理器 - MPU E300 ext tmp Qual333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CZQAGD 功能描述:微處理器 - MPU E300 EXT TEMP PB 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CZQAGDA 功能描述:微處理器 - MPU E300 EXT TEMP PB 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308-KIT 功能描述:開發(fā)板和工具包 - 其他處理器 For MPC8308 Ethernet USB I2C SPI RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8308-NSG 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8308-NSG RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: