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參數(shù)資料
| 型號： | MPC8240LZU250X |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 250 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | TBGA-352 |
| 文件頁數(shù)： | 40/52頁 |
| 文件大?。?/td> | 542K |
| 代理商： | MPC8240LZU250X |
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MPC8240 (rev0.5) Hardware Specifications
45
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
Wakeeld Engineering
781-406-3000
100 Cummings Center, Suite 157H
Beverly, MA 01915
Internet: www.wakeeld.com
Aavid Engineering
972-551-7330
250 Apache Trail
Terrell, TX 75160
Internet: www.aavid.com
Ultimately, the nal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.7.9.1 Internal Package Conduction Resistance
For the TBGA, cavity down, packaging technology, shown in Figure 25, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 27 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 27. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the chip is conducted
through the silicon, the die attach and package spreader, then through the heat sink attach material (or
thermal interface material), and nally to the heat sink where it is removed by forced-air convection.
1.7.9.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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