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參數(shù)資料
| 型號： | MPC8240LZU250X |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 250 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | TBGA-352 |
| 文件頁數(shù)： | 38/52頁 |
| 文件大?。?/td> | 542K |
| 代理商： | MPC8240LZU250X |
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MPC8240 (rev0.5) Hardware Specifications
43
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
There is no standardized way to number the COP header shown in Figure 24; consequently, many different
pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-
right, while others use left-to-right then top-to-bottom, while still others number the pins counter clockwise
from pin one (as with an IC). Regardless of the numbering, the signal placement recommended in is
common to all known emulators.
1.7.9 Thermal Management Information
This section provides thermal management information for the tape ball grid array (TBGA) package for air-
cooled applications. Proper thermal control design is primarily dependent upon the system-level design—
the heat sink, airow and thermal interface material. To reduce the die-junction temperature, heat sinks may
be attached to the package by several methods—adhesive, spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly; see Figure 25.
Figure 25. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 26 depicts the die junction-to-ambient thermal resistance for four typical cases:
1) A heat sink is not attached to the TBGA package and there exists high board-level thermal loading of
adjacent components.
2) A heat sink is not attached to the TBGA package and there exists low board-level thermal loading of
adjacent components.
3) A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and there exists high board-
level thermal loading of adjacent components.
4) A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and there exists low board-
level thermal loading of adjacent components.
Adhesive
or
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
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| MPC8241LVR166D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LVR200D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LVR266D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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