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參數(shù)資料
| 型號： | MN18R1628DF0-CT9 |
| 元件分類： | DRAM |
| 英文描述： | 128M X 18 RAMBUS MODULE, XMA200 |
| 文件頁數(shù)： | 9/16頁 |
| 文件大?。?/td> | 514K |
| 代理商： | MN18R1628DF0-CT9 |
Page 1
Version 1.2 Dec. 2003
MP18R1624(8)DF0
MN18R1624(8)DF0
Overview
The NexMod module is a general purpose for high-
performance memory subsystem suitable for a broad range
of applications including networking, digital consumer,
mobile "Thin and light" PCs, and other applications systems
where high bandwidth and low latency are required.
The NexMod product family addresses the needs of
customers designing space-constrained systems. The Single-
Channel RDRAM NexMod memory module is a cost
effective, small volumetric form factor solution that provides
virtually all the components needed for a complete Rambus
Channel. The NexMod module simplifies system layout and
speeds time-to-market by placing the end-of-channel termi-
nation, VRM(Voltage Regulator Module) and DRCG(Direct
Rambus Clock Generator) all on the module.
The NexMod module is consisted of 288Mb RDRAM
devices. These are extremely high speed CMOS DRAMs
organized as 16M words by 18 bits. The use of Rambus
Signaling Level(RSL) technology permits up to 1066MHz
transfer rates while using conventional system and board
design technologies. RDRAM devices are capable of
sustained data transfers up to at 0.94ns per two bytes (7.5ns
per 16 bytes)
The RDRAM Architecture enables the highest sustained
bandwidth for multiple, simultaneous, randomly addressed,
memory transactions. The seperate control and data buses
with independent row and column control yield high bus
efficiency. The RDRAM device’s thirty-two bank architec-
ture supports up to four simultaneous transactions per
device.
Features
High speed up to 1066MHz RDRAM storage
200 bottom connector pads with 1.27mm pad spacing
Module footprint : 1.1 inches x 2.0 inches
Module PCB size : 50.80mm x 27.94mm x 1.0mm
Interposer type-1 PCB size: 7.62mm x 26.67mm x 1.1mm
Interposer type-2 PCB size: 7.62mm x 26.67mm x 2.1mm
Each RDRAM device has 32 banks, for a total of 128/256
banks on 144MB/288MB module respectively
Serial Presence Detect(SPD) support
Operates from a 2.5 volt supply (± 5%)
Low power and powerdown self refresh modes
Sperate Row and Column buses for heigher efficiency
WBGA package (92 balls)
Simplifies system layout and speeds time-to-market
- Terminations/DRCG/VRM(generates Vterm) on module
- RDRAM VREF generated on module
Stacked PCB design improves signal integrity and margin
- Shortened channel length by stacking PCB and placing
termination on module
- Optional BGA or PGA connectors to mainboard enable
mounting flexibility
- BGA interposers within module
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available for NexMod modules.
Table 1: Part Number by Freq. & Latency
Form Factor
The NexMod modules are offered in 200-ball(or pin)
1.27mm bottom connector ball(or pin) pitch form factor
suitable for 200 contact NexMod connectors. Figure 1
below, shows a eight device NexMod module.
Organization
Speed
Part Number
Bin
I/O
Freq.
(MHz)
trac (Row
Access
Time) ns
64M x 18
-CT9
1066
32P
MNa(Pb)18R1624DF0-CT9
a. BGA type connector
b. PGA type connector
-CM8
800
40
MN(P)18R1624DF0-CM8
128M x 18
-CT9
1066
32P
MN(P)18R1628DF0-CT9
-CM8
800
40
MN(P)18R1628DF0-CM8
(16Mx18)*4(8)pcs NexMod Module based on 288Mb D-die, 32s banks,16K/32ms Refresh, 2.5V
Figure 1 : NexMode Module shown with heat spreader
removed
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