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參數(shù)資料
| 型號： | MN18R1628DF0-CT9 |
| 元件分類： | DRAM |
| 英文描述： | 128M X 18 RAMBUS MODULE, XMA200 |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 514K |
| 代理商： | MN18R1628DF0-CT9 |
Page 14
Version 1.2 Dec. 2003
MP18R1624(8)DF0
MN18R1624(8)DF0
NexMod Module Marking
The NexMod modules available from Samsung are marked
like Figure 5 below. This marking also assists users to
specify and verify if the correct NexMod modules are
installed in their systems. In the diagram, a label is shown
attached to the NexMod module’s heat spreader.
Information contained on the label is specific to the NexMod
module and provides RDRAM device information without
requiring removal of the NexMod module’s heat spreader.
Figure 5: NexMod Module Marking Example
Label Field
Description
Marked Text
Unit
A
Vendor Logo
NexMod Module Vendor SAMSUNG Logo Area
SAMSUNG
-
B
Country
Country of origin
KOREA
-
C
Year & Week code
Manufactured Year & Week code
yyww
-
D
Module Memory
Capacity
Number of 9-bit MBytes of RDRAM storage in
NexMod
Module
128/256MB
MBytes
E
Number of
RDRAM devices
Number of RDRAM devices contained in the
NexMod
Module
4/8
RDRAM
devices
F
ECC Support
Indicates whether the NexMod module supports 9 (ECC)
bit Bytes
ECC = 9 bit Bytes
-
G
Notice!
Hot surface caution notice.
-
H
Caution Logo
ISO Standard
-
I
Gerber & SPD
Version
PCB Gerber file & SPD code version used on
NexMod
Module
Gerber :
SPD
: 2 = 1.3 ver.
-
J
tRAC
Row Access Time
-32P, -40
ns
K
Memory Speed
Data transfer speed for RDRAM device
1066, 800
MHz
L
Part No.
SAMSUNG
NexMod Module part No.
See Table 1
-
M
Connector type
Module connector to main board
BGA/PGA
-
N
Index pin marking
the direction of J1 connector’s pin #1
-
G
L
I
D
KOREA
0310
256MB/8 BGA 1066-32P ECC
MN18R1628DF0-CT9
102
Warranty Void
If Removed
A
B
C
E
F
M K
J
N
H
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