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      參數(shù)資料
      

      


      


      
型號(hào)：
MN18R1628DF0-CT9

      

      
元件分類：
DRAM

      

      
英文描述：
128M X 18 RAMBUS MODULE, XMA200

      

      
文件頁(yè)數(shù)：
7/16頁(yè)

      

      
文件大?。?/td>
514K

      

      
代理商：
MN18R1628DF0-CT9


      

      

      

	
      
    
    

    
      
	
      Page 14
      Version 1.2 Dec. 2003
      MP18R1624(8)DF0
      MN18R1624(8)DF0
      NexMod Module Marking
      The NexMod modules available from Samsung are marked
      like Figure 5 below. This marking also assists users to
      specify and verify if the correct NexMod modules are
      installed in their systems. In the diagram, a label is shown
      attached to the NexMod module’s heat spreader.
      Information contained on the label is specific to the NexMod
      module and provides RDRAM device information without
      requiring removal of the NexMod module’s heat spreader.
      Figure 5: NexMod Module Marking Example
      Label Field
      Description
      Marked Text
      Unit
      A
      Vendor Logo
      NexMod Module Vendor SAMSUNG Logo Area
      SAMSUNG
      -
      B
      Country
      Country of origin
      KOREA
      -
      C
      Year & Week code
      Manufactured Year & Week code
      yyww
      -
      D
      Module Memory
      Capacity
      Number of 9-bit MBytes of RDRAM storage in
      NexMod
      Module
      128/256MB
      MBytes
      E
      Number of
      RDRAM devices
      Number of RDRAM devices contained in the
      NexMod
      Module
      4/8
      RDRAM
      devices
      F
      ECC Support
      Indicates whether the NexMod module supports 9 (ECC)
      bit Bytes
      ECC = 9 bit Bytes
      -
      G
      Notice!
      Hot surface caution notice.
      -
      H
      Caution Logo
      ISO Standard
      -
      I
      Gerber & SPD
      Version
      PCB Gerber file & SPD code version used on
      NexMod
      Module
      Gerber :
      SPD
      : 2 = 1.3 ver.
      -
      J
      tRAC
      Row Access Time
      -32P, -40
      ns
      K
      Memory Speed
      Data transfer speed for RDRAM device
      1066, 800
      MHz
      L
      Part No.
      SAMSUNG
      NexMod Module part No.
      See Table 1
      -
      M
      Connector type
      Module connector to main board
      BGA/PGA
      -
      N
      Index pin marking
      the direction of J1 connector’s pin #1
      -
      G
      L
      I
      D
      KOREA
      0310
      256MB/8 BGA 1066-32P ECC
      MN18R1628DF0-CT9
      102
      Warranty Void
      If Removed
      A
      B
      C
      E
      F
      M K
      J
      N
      H
      
    
      
    
    
      


      


      

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