參數(shù)資料
型號(hào)： MN18R1628DF0-CT9
元件分類： DRAM
英文描述： 128M X 18 RAMBUS MODULE, XMA200
文件頁數(shù)： 5/16頁
文件大?。?/td> 514K
代理商： MN18R1628DF0-CT9
Page 12
Version 1.2 Dec. 2003
MP18R1624(8)DF0
MN18R1624(8)DF0
3.30mm [0.129]
1.10mm
2.10mm [0.083]
4.50mm [0.177]
49.53mm [1.950]
13.48mm [0.530]
3.30mm [0.129]
1.10mm
1.10mm [0.043]
10.43mm [0.410]
Physical Dimension -2 (Vertical dimension)
VRM, DRCG, Termination resistors
Module Heat spreader
BGA interposers
288Mb RDRAM devices
PGA or BGA
Figure 5: NexMod Module Vertical Dimension
mainboard
49.53mm [1.950]
2.10mm [0.083]
Figure 5a : NexMod Module vertical structure
Figure 5b : 288MB NexMod Module with PGA connector vertical dimensions
Figure 5c : 288MB NexMod Module with BGA connector vertical dimensions
10.20mm [0.401]
The following defines the NexMod module dimensions. All units are in millimeters with inches in brackets[ ], where appro-
priate. The dimension without tolerance specification use the default tolerance of ±0.4[±0.015].
cnnection to
[0.043]
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