參數(shù)資料
型號: MCIMX31VMN5CR2
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 532 MHz, MICROPROCESSOR, PBGA473
封裝: 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-473
文件頁數(shù): 24/122頁
文件大?。?/td> 1418K
代理商: MCIMX31VMN5CR2
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
12
Freescale Semiconductor
Electrical Characteristics
NOTES
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
2. Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6.
Thermal test board meets JEDEC specification for this package.
3. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board
meets JEDEC specification for the specified package.
4. Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The
cold plate temperature is used for the case temperature. Reported value includes the thermal
resistance of the interface layer.
5. Thermal characterization parameter indicating the temperature difference between the package
top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
i.MX31
Product
Family
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