
Freescale Semiconductor, Inc., 2007. All rights reserved.
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Data Sheet, Advance Information
This document contains information on a product under development. Freescale reserves the right to change or discontinue this
product without notice.
Document Number: MCIMX27
Rev. 0.1, 7/2007
This document contains information on a new
product. Specifications and information herein
are subject to change without notice.
i.MX27
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Ordering Information
See
Table 1
on page 4
for ordering information.
1
Introduction
The i.MX27 (MCIMX27) Multimedia Applications
Processor represents the next step in low-power,
high-performance application processors.
Based on an ARM926EJ-S microprocessor core, the
i.MX27 processor provides the performance with
low-power consumption required by modern digital
devices such as the following:
Feature-rich cellular phones
Portable media players and mobile gaming
machines
Personal digital assistants (PDAs) and wireless
PDAs
Portable DVD players
Digital cameras
The i.MX27 processor features the advanced and
power-efficient ARM926EJ-S core operating at speeds
up to 400 MHz, and is optimized for minimal power
consumption using the most advanced techniques for
power saving (for example, DPTC, power gating, and
i.MX27 Data Sheet
Multimedia Applications
Processor
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Ordering Information . . . . . . . . . . . . . . . . . 4
2 Functional Description and Application
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 ARM926 Microprocessor Core Platform . . . 4
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5
2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 9
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . 27
3.1 Power-Up Sequence . . . . . . . . . . . . . . . . 36
3.2 EMI Pins Multiplexing . . . . . . . . . . . . . . . . 36
3.3 Electrical Characteristics . . . . . . . . . . . . . 41
3.4 i.MX27 Chip-Level Conditions . . . . . . . . . 41
3.5 Module-Level Electrical Specifications . . . 45
4 Package Information and Pinout . . . . . . . . 103
4.1 Full Package Outline Drawing . . . . . . . . 103
4.2 Pin Assignments . . . . . . . . . . . . . . . . . . . 104
5 Product Documentation . . . . . . . . . . . . . . . 117
6 Revision History . . . . . . . . . . . . . . . . . . . . . 117