參數(shù)資料
型號(hào)： MC56F8323
廠商： Motorola, Inc.
英文描述： 16-bit Hybrid Controllers
中文描述： 16位混合控制器
文件頁(yè)數(shù)： 36/140頁(yè)
文件大?。?/td> 1981K
代理商： MC56F8323
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56F8323 Technical Data, Rev. 11.0
130
Freescale Semiconductor
Preliminary
C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two
of the IO cell types used on the 56800E reveal that the power-versus-load curve does have a non-zero
Y-intercept.
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and
frequency at which the outputs change. Table 10-25 provides coefficients for calculating power dissipated
in the IO cells as a function of capacitive load. In these cases:
TotalPower =
Σ((Intercept + Slope*Cload)*frequency/10MHz)
where:
Summation is performed over all output pins with capacitive loads
TotalPower is expressed in mW
Cload is expressed in pF
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V =
0.5 for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs
driving 10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
Table 10-25 IO Loading Coefficients at 10MHz
Intercept
Slope
8mA CMOS 3-State Output Pad with Input-Enabled Pull-Up
1.3
0.11mW / pF
4mA CMOS 3-State Output Pad with Input-Enabled Pull-Up
1.15mW
0.11mW / pF
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8323EVM 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 MC56F832X Dev Kit RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MC56F8323EVM 制造商:Freescale Semiconductor 功能描述:Tools Development kit Kit Con
MC56F8323EVME 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 MC56F8323 EVAL BRD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MC56F8323EVME 制造商:Freescale Semiconductor 功能描述:Evaluation Kit for MC56F832x and MC56F81
MC56F8323MFB60 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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