- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45206 > MC56F8322VFAE (FREESCALE SEMICONDUCTOR INC) 0-BIT, 120 MHz, OTHER DSP, PQFP48 PDF資料下載
參數(shù)資料
| 型號： | MC56F8322VFAE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 0-BIT, 120 MHz, OTHER DSP, PQFP48 |
| 封裝： | ROHS COMPLIANT, LQFP-48 |
| 文件頁數(shù)： | 38/136頁 |
| 文件大?。?/td> | 719K |
| 代理商： | MC56F8322VFAE |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁當(dāng)前第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁
56F8322 Techncial Data, Rev. 16
132
Freescale Semiconductor
Preliminary
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation of the 56F8322/56F8122:
Provide a low-impedance path from the board power supply to each VDD pin on the device and from the
board ground to each VSS (GND) pin
The minimum bypass requirement is to place six 0.01–0.1
μF capacitors positioned as close as possible to
the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each
of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are less than 0.5 inch per capacitor lead
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and VSS
Bypass the VDD and VSS layers of the PCB with approximately 100μF, preferably with a high-grade
capacitor such as a tantalum capacitor
Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid
application
of
any
voltages
higher
than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC56F8347VPY60 | 16-BIT, 120 MHz, OTHER DSP, PQFP160 |
| MC56F8347MPY60 | 16-BIT, 120 MHz, OTHER DSP, PQFP160 |
| MC56F8356MFV60 | 16-BIT, 120 MHz, OTHER DSP, PQFP144 |
| MC56F8156VFVE | 16-BIT, 120 MHz, OTHER DSP, PQFP144 |
| MC56F8356MFVE | 16-BIT, 120 MHz, OTHER DSP, PQFP144 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC56F8322VFAER2 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CNTRLR RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| MC56F8323 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
| MC56F8323EVM | 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F832X Dev Kit RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MC56F8323EVM | 制造商:Freescale Semiconductor 功能描述:Tools Development kit Kit Con |
| MC56F8323EVME | 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F8323 EVAL BRD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。