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參數(shù)資料
| 型號： | MC56F8322VFAE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 0-BIT, 120 MHz, OTHER DSP, PQFP48 |
| 封裝： | ROHS COMPLIANT, LQFP-48 |
| 文件頁數(shù)： | 37/136頁 |
| 文件大?。?/td> | 719K |
| 代理商： | MC56F8322VFAE |
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Thermal Design Considerations
56F8322 Technical Data, Rev. 16
Freescale Semiconductor
131
Preliminary
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
The junction to ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where:
TA
=
Ambient temperature for the package (oC)
RθJΑ = Junction to ambient thermal resistance (
oC/W)
PD
=
Power dissipation in the package (W)
RθJA = Package junction to ambient thermal resistance °C/W
RθJC = Package junction to case thermal resistance °C/W
RθCA = Package case to ambient thermal resistance °C/W
TT
=
Thermocouple temperature on top of package (oC)
Ψ
JT
=
Thermal characterization parameter (oC)/W
PD
=
Power dissipation in package (W)
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MC56F8322VFAER2 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CNTRLR RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| MC56F8323 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
| MC56F8323EVM | 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F832X Dev Kit RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MC56F8323EVM | 制造商:Freescale Semiconductor 功能描述:Tools Development kit Kit Con |
| MC56F8323EVME | 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F8323 EVAL BRD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
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